SEMICON West 2024: Riding the Generative AI Winds of Change Jul 15, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ECTC 2024: Advanced Packaging Engineers to the Rescue! Jun 01, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
The Nexus of Innovation for U.S. Semiconductor Manufacturing May 07, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Taking 3D Integration to the Next LevelJul 29, 2015 · By Francoise von Trapp · Blogs There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t...
Semiconductor Supplier Updates from SEMICON West 2015Jul 27, 2015 · By Francoise von Trapp · Blogs No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with...
At AMD, Die Stacking Hits the Big TimeJul 22, 2015 · By Francoise von Trapp · Blogs It’s official. Die stacking and interposer integration have been implemented in a high volume consumer application. AMD officially launched the...
SEMICON West Keynote Panel: Semiconductor Manufacturing is a Team SportJul 20, 2015 · By Francoise von Trapp · Blogs I almost didn’t attend the keynote panel titled, Scaling the Walls of Sub 14nm Manufacturing, at SEMICON West last week,...
The IoT at SEMICON West 2015: We Just Can’t Get EnoughJul 19, 2015 · By Francoise von Trapp · 3D Event Coverage As a topic of much discussion and debate, the Internet of Things (IoT) stole the show once again, this time...
Congratulations to the Winners of the 2015 3D InCites AwardsJul 17, 2015 · By Francoise von Trapp · Blogs For the third consecutive year, 3D integration enthusiasts gathered at the Impress Lounge at SEMICON West for the 2015 3D...
Executive Viewpoint: Providing A Golden Boat of WafersJul 14, 2015 · By Francoise von Trapp · Blogs As 3D integration technologies become established in low volume manufacturing, the supply chain is gearing up to address high volume...
aveni: The New Name and Face of AlchimerJul 13, 2015 · By Francoise von Trapp · Blogs I’ve been following the Alchimer story as it unfolds ever since I first started following the course of 3D integration...
The 2015 3D InCites Guide to 3D at SEMICON WestJul 02, 2015 · By Francoise von Trapp · 3D Event Coverage 2015 will go down in history as the year 3D finally got real. It’s not an emerging technology anymore, and...
Will the Internet of Everything Really Make the World a Better Place?Jun 30, 2015 · By Francoise von Trapp · Blogs I recently started watching the HBO sitcom, Silicon Valley. If you haven’t seen it, it’s a great parody of what...
Amkor Execs Outline Strategy for the Future of Advanced PackagingJun 18, 2015 · By Francoise von Trapp · Blogs I was invited to attend Amkor’s bi-annual customer symposium, which was held in Santa Clara two weeks ago. It was...
Who Should Win the First 3D InCites Individual Achievement Award?Jun 09, 2015 · By Francoise von Trapp · Blogs The journey to the commercialization of 3D integration technologies has been long – longer than most expected – an arduous....
Will the Chip Industry Benefit from the Internet of Everything?Jun 02, 2015 · By Francoise von Trapp · 3D Event Coverage The Internet of Things (IoT) or as Cisco calls it, the Internet of Everything, has been the theme du jour for...
ECTC 2015: Advanced Packaging Sets Sail in San DiegoMay 29, 2015 · By Francoise von Trapp · 3D Event Coverage The 65th annual Electronics Technology Components Conference (ECTC 2015) logged record numbers (over 1500 attendees, 20% increase over last year) as...
Spotlight on FOWLP, Monolithic 3D IC and 3D TSVsMay 13, 2015 · By Francoise von Trapp · Blogs Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the...
3D InCites Turns Six and Hits Over 1000 PostsMay 06, 2015 · By Francoise von Trapp · Blogs Today, LinkedIN reminded me that 3D InCites just celebrated its 6th anniversary. I also noticed that Paul Werbaneth’s latest 3D+...
How Will Future Capex Spending Affect Semiconductor Suppliers?Apr 22, 2015 · By Francoise von Trapp · 3D Event Coverage At the recent Arizona SEMI Breakfast Forum, held April 17, 2015, semiconductor suppliers gathered at the Mother Ship (aka Intel) in Ocotillo,...
A Trip Down Silicon Valley’s Memory Lane with Bill HugleApr 21, 2015 · By Francoise von Trapp · Blogs Inspired by all the recent attention for the 50th anniversary of Moore’s Law and SEMI’s cool new Infographic series, which...
Will the Internet of Things Deliver on its Promise?Apr 09, 2015 · By Francoise von Trapp · Blogs “Firsts are good but lasts are better. The Internet of Everything (IoE) is ushering in many firsts but its legacy...
IMAPS DPC 2015: Has 3D IC Hit a Holding Pattern?Mar 25, 2015 · By Francoise von Trapp · 3D Event Coverage From the perspective of 3D integration and its march towards commercialization, there was not much new being presented at the 2015...