Announcing the Winners of the 2025 3D InCites Awards
Feb 04, 2025 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 12
IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging
The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a...
At the 2016 S3S Conference, 3D Integration is Bringing Sexy Back
The IEEE S3S Conference (shorthand for the IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference; quite a mouthful, I know!) is an...
More Food for Thought From The 2016 European MEMS Summit
Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held September 15-16 in...
European MEMS Summit 2016: Are MEMS Manufacturers Richer than Last Year?
After the European MEMS Summit 2016 concluded on Friday afternoon (September 15-16, 2016), one of the attendees asked me which...
MEMS and Sensors Industry Group Becomes Part of SEMI
Peter Clarke, EE Times, and I both agree – the biggest news of this year’s SEMI MEMS Summit, which took...
Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package
There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP)... Top Ten Reasons to Attend the 2016 European MEMS Summit
Ok everybody, here it is, back by popular demand: the TOP TEN reasons (this time told in photos) why you...
The 2016 3D InCites Awards Scholarship goes to Sophie Mathis!
Ever since we first established 3D InCites Awards program in 2013, our intention was to use the funds generated by...
SEMICON West 2016: Update from the Semiconductor Suppliers
Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with...
Making Connections at SEMICON West 2016
If you attended SEMICON West 2016 last week, you probably noticed that the event is undergoing a metamorphosis. It was...
And the Winners of the 2016 3D InCites Awards are…..
For the fourth consecutive year, the Impress Lounge played host to the 3D InCites Awards Ceremony, during which individuals, companies,...
3D InCites Guide to SEMICON WEST 2016
In past years, we have provided 3D InCites readers with a guide for navigating through the myriad programs that specifically...
Executive Viewpoint: The New Advanced Packaging Landscape
You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had...
Supplier Updates from ECTC 2016
In addition to attending the panel and plenary sessions at ECTC 2016, which took place May 31-June 3, 2016, I...
ECTC 2016: Is the Life after Moore’s Law?
Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic...
Words of Advice From Successful Women in Advanced Packaging
For the second consecutive year, Beth Keser, Qualcomm, organized and moderated the CMPT Woman’s Panel and Reception as part of...
ECTC 2016: Memory Technology Advances and Prospects for Packaging
At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled,...
IPSO Challenge Update: The Smart Rock Bolt Success Story
Six months ago, I interviewed Jens Eliasson, associate professor at Luleå University of Technology (LTU), and co-developer of the Smart Rock...
Advanced Packaging and 3D come to MRS Spring Meeting
For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never...
