SEMICON West 2024: Riding the Generative AI Winds of Change Jul 15, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ECTC 2024: Advanced Packaging Engineers to the Rescue! Jun 01, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
The Nexus of Innovation for U.S. Semiconductor Manufacturing May 07, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ECTC 2016: Is the Life after Moore’s Law?Jun 10, 2016 · By Francoise von Trapp · Blogs Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic...
Words of Advice From Successful Women in Advanced PackagingJun 07, 2016 · By Francoise von Trapp · Blogs For the second consecutive year, Beth Keser, Qualcomm, organized and moderated the CMPT Woman’s Panel and Reception as part of...
ECTC 2016: Memory Technology Advances and Prospects for PackagingJun 04, 2016 · By Francoise von Trapp · Blogs At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled,...
IPSO Challenge Update: The Smart Rock Bolt Success StoryMay 18, 2016 · By Francoise von Trapp · Blogs Six months ago, I interviewed Jens Eliasson, associate professor at Luleå University of Technology (LTU), and co-developer of the Smart Rock...
Advanced Packaging and 3D come to MRS Spring MeetingApr 01, 2016 · By Francoise von Trapp · 3D In-Depth For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never...
EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016Mar 22, 2016 · By Francoise von Trapp · Blogs This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number...
System-in-Package was the Big Story at IMAPS DPC 2016Mar 20, 2016 · By Francoise von Trapp · Blogs “The sum is greater than the whole of its parts.” ~ Aristotle (and Bill Chen) While the technology tracks offered...
The HBM Supply Chain is Open for Business!Mar 11, 2016 · By Francoise von Trapp · Blogs Last June, AMD made 3D integration history with its introduction of the Fiji gaming processor unit (GPU), which for the...
From the Ashes of Moore’s Law: More than Moore Has ArrivedFeb 12, 2016 · By Francoise von Trapp · Blogs Now that the industry has finally called it a day for Moore’s law, will More than Moore be our guiding...
Success for 3D: What A Difference a Year MakesJan 31, 2016 · By Francoise von Trapp · Blogs During the 2015 European 3D TSV Summit, I drove attendees to distraction by asking each presenter what success looked like...
European 3D Summit: Putting 3D Packaging To WorkJan 31, 2016 · By Francoise von Trapp · Blogs Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging...
The European 3D Summit: The Gala QuizJan 28, 2016 · By Francoise von Trapp · Blogs Hands-down, the best part of last week’s 2016 European 3D Summit was the Gala Dinner at the Chateau Sassenage, and...
European 3D Summit: Market Analysts Weigh in on FOWLP, 3D Packaging, and SiPJan 26, 2016 · By Francoise von Trapp · Blogs As it has in year’s past, the 2016 European 3D Summit kicked off with a market briefing. We heard from...
The European 3D Summit: From Roadmaps to RealityJan 25, 2016 · By Francoise von Trapp · 3D Event Coverage In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected...
3D ASIP 2015: 3D Manufacturing Processes from the Early Days to the PresentJan 01, 2016 · By Francoise von Trapp · Blogs For the first time since the 3D Architectures for Semiconductor Integration and Packaging (3DASIP) Conference was established, the organizing committee...
At 3D ASIP 2015, Variety is the Spice of LifeDec 20, 2015 · By Francoise von Trapp · 3D Event Coverage Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s...
Happy Holidays, from your friends at 3D InCites!Dec 18, 2015 · By Francoise von Trapp · Blogs Happy Holidays!
With the Potential to Save Lives, Smart Rock Bolt Takes Home the IPSO CHALLENGE 2015 Grand PrizeDec 04, 2015 · By Francoise von Trapp · Blogs Now in its third year, the IPSO CHALLENGE 2015, an annual event run by the IPSO Alliance, requires entrants to...
Executive Viewpoint: Why the European 3D Summit is Going Beyond TSVsNov 20, 2015 · By Francoise von Trapp · 3D Event Coverage Remember back a few years ago when 3D and TSV were considered to be the pretty much the same thing?...
Questions Answered at the 2015 MEMS Executive CongressNov 19, 2015 · By Francoise von Trapp · 3D Event Coverage This final post from my time at the 2015 MEMS Executive Congress addresses some random questions I had that were...