The 3D InCites Podcast Backtrack – 2024 in Review
Dec 18, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts
Picking up the Pace of Panel-level Advanced Packaging at Onto Innovation
How A Collaborative Partnership Is Accelerating PLP Innovation Panel-level advanced packaging technologies have been in development for more than a...
Leaning Into Interconnectology – Musings from IMAPS Symposium 2024
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston...
ASU’s SWAP Hub and National Collaborations Shape U.S. Microelectronics Leadership
In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira...
Witnessing Foundry 2.0 in Action
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member...
SEMICON West 2024: Riding the Generative AI Winds of Change
Deepak Chopra said, “All great changes are preceded by chaos.” Here’s my Aha! moment from SEMICON West 2024: After great...
ECTC 2024: Advanced Packaging Engineers to the Rescue!
If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then...
The Nexus of Innovation for U.S. Semiconductor Manufacturing
Will Arizona be the nexus of innovation for U.S. semiconductor manufacturing? It certainly looks that way. The speakers and panelists...
IMAPS DPC 2024 Makes Advanced Packaging Fun Again!
At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell...
ISS Europe 2024: Succeeding in an Evolving Global Semiconductor Landscape
When I interview members for the 3D InCites Podcast at industry events, I often ask them, “What did you come...
Announcing the Winners of the 2024 3D InCites Awards
It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to...
Leading The Charge to One Trillion Dollars
A Conversation About Leadership with SEMI CEO Ajit Manocha For the past few years, we’ve heard semiconductor market analysts prognosticate...
SEMI ISS 2024: Heavy Winds Make It Tough to Chart A Course
As they do every year, semiconductor industry leaders gathered in Half Moon Bay, CA in early January for SEMI ISS...
This. Is. Community.
2023 was a year of growth and change for 3D InCites, as well as me personally. In April, I left...
Netherlands-Flanders Economic Mission Comes to Phoenix
One of the best things about being headquartered in Phoenix, AZ is having a front-row seat of all the semiconductor...
Will 3D Heterogeneous System Integration Help Scale the ESG Wall?
At SEMICON Europa 2023, we heard more good news about 3D heterogeneous Integration from speakers at the CEO Summit and...
Tapping into the Power of the Microelectronics Community
In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far,...
Wear A Dress To Work and Other Ways to Foster Gender Gap Allyship
I have attended my share of DEI and allyship-focused events in the past few years attended by both women and...
Community Member Conversations from IMAPS 2023
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
IMAPS Keynotes Focus on Heterogeneous Integration for HPC, AI, and EVs
This year’s IMAPS keynotes focused on advancements in heterogeneous integration (HI) technologies and chiplet architectures enabled by HI, driven by...
