Nuclear is Out. How Do We Solve the High Tech Sustainability Problem?
Nov 20, 2024 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 9
FLEX2018 Shows how 3D Printed Electronics Will Impact Our Lives
If you drive a late model car, you may be impressed by the many sensors that capture engine conditions, tire...
The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2
Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on... The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1
Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D...
IEDM 2017 Looks Way Beyond Moore’s Law
The International Electronic Device Manufacturing Conference (IEDM) has always focused on device scaling, successfully guiding our industry for several decades along...
Sir Walter Raleigh towered above the 50th IMAPS Symposium
Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and...
EDPS 2017: NOT the usual Electronic DESIGN Process Symposium
When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold...
TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem
Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara...
IMAPS 2017 SiP Conference Takes on Sonoma
California’s Wine Country attracts visitors from all over the world. They can enjoy the scenic countryside, historic places, golf courses,...
Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions
I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for...
Mission Impossible? Not for SEMI!
San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at...
DAC 54: From Grey to Colorful and Solutions-minded Messaging
The 54th Design Automation Conference (DAC 54) at the Austin Convention Center was very different, compared to the last several...
Will IoT be the Next Killer App for Semiconductors?
At the end of April, I attended the Internet of Things (IoT) Developers Conference at the Santa Clara Convention Center....
Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA
The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very...
IMAPS DPC 2017 Covers Range of High-tech Topics, Including EDA
The WeKoPa Resort near Phoenix was the venue for the latest IC packaging focused conference, IMAPS DPC 2017, which took...
Highlights of the 23rd TSMC Symposium
On March 15, 2017, TSMC held its 23rd Symposium, based on popular request, at the Santa Clara Convention Center. I...
13th 3D ASIP Conference Demonstrates Manufacturer’s Commitment
The 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference is one of the biggest (if not THE biggest)...
IEDM 2016 Demonstrates Device Physics For The Semiconductor Industry
In the past few months I have been reading a lot of depressing news about our semiconductor industry’s declining growth...
Pasadena offers Roses and Technology
California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It... TSMC’s OIP Symposium 2016
After a fairly long vacation it’s very hard to get back to work. That’s why I was really glad that...
