3D Integration Themes Become a Reality at IEDM 2024
Jan 13, 2025 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 7
Is The HIR the Best Path to Increased Revenues?
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry...
Has Google Discovered the Advantages of Advanced IC Packaging Technologies?
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti...
Big Data, Speed and Security Dominate DesignCon 2020
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January...
ISS 2020: How to Win in Our Data-driven World – Part 2
In Part 1 of my ISS 2020 blog, I described Monday’s opening keynote by LAM’s CTO, Richard Gottscho. He explained...
ISS 2020: How to Win in Our Data-driven World
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at...
Novel Multi-die Integration Concept Offers Big Benefits
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of...
IEDM 2019: Making Electronic Systems Smarter, Safer, and More Reliable
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference...
MEPTEC’s Annual IC Packaging Industry Update
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President...
GSA Awards Dinner celebrates 25 years of Recognizing the Best of the Semiconductor Industry
A few thousand semiconductor experts, including many high-level executives, got together on December 5, 2019, celebrate the Global Semiconductor Alliance’s...
Talking about Neural Networks and SoC Design Challenges
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November...
Microtech Ventures brings a New MEMS and Sensors Summit to Town
From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation...
3D VLSI Open Workshop Showcases 3D IC Supply Chain Capabilities
Severine Cheramy, Director 3D Business Development, at CEA-Leti, recently brought key partners of Leti’s 3D-IC programs together at the 6th...
MSEC 2019: MEMS and Sensors Have a Lot to offer for System Designers
San Diego’s Coronado Island Marriott Resort and Spa hosted SEMI’s MEMS and Sensors Executive Congress (MSEC 2019) from Oct 23...
Are You Keeping The World Clean for Your Children and Grandchildren?
Adjusting or repairing some of the sprinkler heads on my lot is a regular Spring duty for me. This year,...
Highlights from EDPS 2019
The Electronic Design Process Symposium – EDPS 2919 – is known in the IC design community as a rather small (50...
Strategic Materials Conference Focuses on Complex Challenges
Materials have a major impact on reliability, performance, cost and other key parameters of electronic solutions. SEMI’s recent Strategic Materials...
Reaping the Benefits of a Design and Manufacturing Ecosystem
As it does each year, TSMC recently brought 45 of its ecosystem partners together for its annual Open Innovation Platform®...
A Look at US Investments in Heterogeneous Integration
The semiconductor industry is not only very capital-intensive, but investors experience very long payback times. Both limit the availability of...
The Path to Smarter Fabs
Working from the mantra “None of us knows as much as all of us,” SEMI invited manufacturers of electronic components...
