3D Integration Themes Become a Reality at IEDM 2024
Jan 13, 2025 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 6
EDPS 2020: An Inside Look at the Manufacturing-centric Presentations
Like many other industry conferences, the Electronic Design Process Symposium (EDPS 2020) had to go virtual. Not only did it...
IC Packaging Technologies Contribute to Smaller, Faster, Cheaper Electronic Systems with Longer Battery Life
During in-person and on-line meetings, I often discuss with friends the impressive progress our industry has made in the last...
Highlights from SEMI’s Smart MedTech Webinar Series
If you bought a new car recently, you must have noticed that it warns you if one of its functions...
The TSMC 2020 Virtual Technology Symposium and OIP Ecosystem Forum
Just like most other events that attract a large number of people, TSMC 2020 events were held online too. While...
Smart Mobility: An Impactful and High-growth Market
About 70% of the U.S. Gross Domestic Product (GDP) is driven by consumer demand. What consumers are looking for is...
ISES 2020 Highlights Asia’s Advanced IC Packaging and HI Capabilities
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for...
DAC 2020 Addresses Chiplet Design and Integration
In the early days of ASIC technology, only logic library elements and basic I/Os with up to 10s of transistors...
TechSearch Presentation Highlights Key Developments in Advanced Packaging
In a recent MEPTEC / iMAPS webinar, Jan Vardaman, President, and Founder of TechSearch International presented growth drivers for advanced packaging...
3D ICs Tear Down the Dreaded Memory Wall and Save Power
About 50 years ago, I started my career as a system-level designer, focused on an interface card for the Siemens...
FCC-approved BLE and LoRa module includes Antenna in Package
In engineering school, I learned that different laws of physics apply when the widely used electricity with 50/60 Hertz gets...
An EDA Perspective on Today’s Advanced Packaging
In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of...
ECTC 2020 Online is Accessible at No Charge
When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging...
EDA and the Heterogeneous Integration Roadmap
In Austria, where I grew up, homes get passed on from generation to generation. Like many Austrians, I had a...
Modeling, Simulation and Test for Multi-die IC Designs
On May 20 MEPTEC’s Executive Director, Ira Feldman, moderated another informative MEPTEC & iMAPS webinar. Two Knowledgeable speakers from Ansys...
Practical Advice for Working Remotely in the 21st Century
This is a brief summary of SEMI’s third webinar in the “Work & Life in the 21st Century” series, broadcast...
Covid-19: The Way Forward for Semiconductor Success
In 2002, the first consulting client for my newly founded eda2asic consulting company was Synplicity, located in Sunnyvale. They focused...
Handel Jones: The Road to Recovery from Covid-19
Covid-19 has created unprecedented problems for health and economies worldwide. Executives must make now important and often very difficult decisions...
Dr. Wally Rhines Talks About the Semiconductor Industry’s Future
As long as the “social distancing” requirement is in force, you won’t see me in person at conferences or any...
Geopolitics and Manufacturing: A Changing Landscape
At the March 11 MEPTEC Luncheon at SEMI, Paul Pickering, Managing Director at Microtech Ventures, braved, together with a rather...
