Nuclear is Out. How Do We Solve the High Tech Sustainability Problem?
Nov 20, 2024 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 12
Breaking Down Walls between Board, Package, and IC Design Steps
Many years ago, when I started in the semiconductor business, the circuit designers only had to worry about functionality and,...
READY – AIM – FIRE! Predictions for 2.5D ICs in 2014
Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so...
Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013
The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
