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Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013Nov 11, 2013 · By Herb Reiter · 3D Event Coverage The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
Comparing Samsung’s 3D NAND with Traditional 3D ICsAug 16, 2013 · By Herb Reiter At last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob...