Nuclear is Out. How Do We Solve the High Tech Sustainability Problem?
Nov 20, 2024 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 11
TSMC 2015 Technology Symposium Highlights Plans for the Coming Year
Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium celebrated 21 years of holding this annual...
SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology Cool
From March 16-20 the annual SEMI-THERM Conference (SEMI-THERM 2015) in San Jose gave me the opportunity to meet many assembly, materials,...
DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2
Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so...
DATE 2015 demonstrates Europe’s commitment to Semiconductors
Full disclosure: I spent the first half of my life in Europe. I was born and raised in Austria, and...
DesignCon 2015: Blasting Through Walls with Holistic Planning
DesignCon’s 2015‘s tag-line “where the chip meets the board”, was a very appropriate message, and summarized in a few words...
Why is it Taking so Long to Ramp Interposer and 3D IC Designs?
And what are we going to do about it in 2015…? A moment ago I finished reading my predictions for...
IEDM 2014 3D Short Course Highlights 3D Memory Cubes for SYSTEM design
Years ago, when I gave my first 3D technology presentations, I noticed very different reactions from my diverse audience: The...
3D ASIP 2014: All Aboard the 3D IC Train!
Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual...
Invitation to Participate in Si2 Survey
Dear Semiconductor / EDA expert, In my role as business development consultant, I, Herb Reiter, am getting involved in many...
IC and System Designers, This Could be the Best Four Hours Spent this Year
Don’t miss a full morning of expert presentations about 3D-IC and Interposer design tools and methodologies! Since 2004, every December RTI...
Kahoots from the IWLPC 3D InCites Panel
Interposer designs and 3D ICs shift a significant part of the value creation to material vendors and assembly/test houses. It’s...
TSMC’s 2014 Open Innovation Platform Ecosystem Forum
Like many years before, I had the opportunity to attend the annual TSMC Open Innovation Platform Ecosystem Forum in San Jose’s Convention...
The Intel Developer Forum 2014
This week I had the privilege to attend my first Intel Developer Forum (IDF). Like many of us, I have...
Highlights from HotChips 2014: 21 HBM Design-ins Ongoing!
Last week, HotChips 2014 (aka HC26) was held at the Flint Center within the De Anza College in Cupertino, California. As in...
Apple and IBM on the Way to Demonstrate That ONE plus ONE is More Than TWO
Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and...
Should EDA vendors, OSATS, and their customers cooperate more?
Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent...
Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?
Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half...
Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D Interposers
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
A Sneak Peek at IITC and AMC 2014
The recent announcement of the International Interconnect Technology Conference (IITC), combined with the Advanced Metallization Conference (AMC) in the Double...
