Meeting Sustainability Goals Hits Political and Technical Headwinds
Feb 26, 2025 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 11
With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these...
SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and...
DAC 2015 Focuses on the Automotive Market
By attracting 7011 EDA and IP developers and users, the 52 Design Automation Conference, held in the South Hall of San...
ECTC 2015: From the Tech Sessions Part 2
As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I...
1551 Industry Experts Demonstrate at ECTC: IC Packaging Technology is Essential for Success
Last week I attended the record-breaking 65th ECTC in San Diego: 20 percent more attendees, compared to last year’s conference...
EDPS 2015 Looks At IC Innovations from the Design Perspective
On Thursday and Friday of last week, Monterey, California’s previous state capital, became the center of presentations and discussions about IC...
TSMC 2015 Technology Symposium Highlights Plans for the Coming Year
Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium celebrated 21 years of holding this annual...
SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology Cool
From March 16-20 the annual SEMI-THERM Conference (SEMI-THERM 2015) in San Jose gave me the opportunity to meet many assembly, materials,...
DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2
Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so...
DATE 2015 demonstrates Europe’s commitment to Semiconductors
Full disclosure: I spent the first half of my life in Europe. I was born and raised in Austria, and...
DesignCon 2015: Blasting Through Walls with Holistic Planning
DesignCon’s 2015‘s tag-line “where the chip meets the board”, was a very appropriate message, and summarized in a few words...
Why is it Taking so Long to Ramp Interposer and 3D IC Designs?
And what are we going to do about it in 2015…? A moment ago I finished reading my predictions for...
IEDM 2014 3D Short Course Highlights 3D Memory Cubes for SYSTEM design
Years ago, when I gave my first 3D technology presentations, I noticed very different reactions from my diverse audience: The...
3D ASIP 2014: All Aboard the 3D IC Train!
Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual...
Invitation to Participate in Si2 Survey
Dear Semiconductor / EDA expert, In my role as business development consultant, I, Herb Reiter, am getting involved in many...
IC and System Designers, This Could be the Best Four Hours Spent this Year
Don’t miss a full morning of expert presentations about 3D-IC and Interposer design tools and methodologies! Since 2004, every December RTI...
Kahoots from the IWLPC 3D InCites Panel
Interposer designs and 3D ICs shift a significant part of the value creation to material vendors and assembly/test houses. It’s...
TSMC’s 2014 Open Innovation Platform Ecosystem Forum
Like many years before, I had the opportunity to attend the annual TSMC Open Innovation Platform Ecosystem Forum in San Jose’s Convention...
The Intel Developer Forum 2014
This week I had the privilege to attend my first Intel Developer Forum (IDF). Like many of us, I have...
