Sustainability and Semiconductors at SEMICON WEST 2024 Jul 22, 2024 · By Dean Freeman · 3D In Context, Blogs
IC Packaging: An Essential Enabler and Differentiator, Part 2Dec 02, 2015 · By Herb Reiter The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1. Wednesday morning started with a IC...
IC Packaging: An Essential Enabler and Differentiator, Part 1Nov 30, 2015 · By Herb Reiter The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major...
Takeaways from the 5th Annual IEEE Global Interposer Technology WorkshopNov 24, 2015 · By Herb Reiter More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC...
Interposers, 3D TSVs, and Alternatives: One Size Does Not Fit AllOct 19, 2015 · By Herb Reiter Whenever Francoise organizes an event, she always manages to compose a mixture of entertainment, real work and valuable education. This...
TSMC’s Grand Alliance: A Powerful EcoSystemSep 29, 2015 · By Herb Reiter On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress...
Ideas for Co-optimizing Chip-Package DesignSep 10, 2015 · By Herb Reiter In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC...
With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory WallAug 25, 2015 · By Herb Reiter In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these...
SEMICON West 2015 Demonstrates the Powerful IC Manufacturing BaseJul 21, 2015 · By Herb Reiter A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and...
DAC 2015 Focuses on the Automotive MarketJun 22, 2015 · By Herb Reiter By attracting 7011 EDA and IP developers and users, the 52 Design Automation Conference, held in the South Hall of San...
ECTC 2015: From the Tech Sessions Part 2Jun 08, 2015 · By Herb Reiter · 3D Event Coverage As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I...
1551 Industry Experts Demonstrate at ECTC: IC Packaging Technology is Essential for SuccessJun 05, 2015 · By Herb Reiter Last week I attended the record-breaking 65th ECTC in San Diego: 20 percent more attendees, compared to last year’s conference...
EDPS 2015 Looks At IC Innovations from the Design PerspectiveApr 28, 2015 · By Herb Reiter · 3D Event Coverage On Thursday and Friday of last week, Monterey, California’s previous state capital, became the center of presentations and discussions about IC...
TSMC 2015 Technology Symposium Highlights Plans for the Coming YearApr 13, 2015 · By Herb Reiter Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium celebrated 21 years of holding this annual...
SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology CoolMar 31, 2015 · By Herb Reiter · 3D Event Coverage From March 16-20 the annual SEMI-THERM Conference (SEMI-THERM 2015) in San Jose gave me the opportunity to meet many assembly, materials,...
DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2Mar 26, 2015 · By Herb Reiter · 3D Event Coverage Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so...
DATE 2015 demonstrates Europe’s commitment to SemiconductorsMar 23, 2015 · By Herb Reiter Full disclosure: I spent the first half of my life in Europe. I was born and raised in Austria, and...
DesignCon 2015: Blasting Through Walls with Holistic PlanningFeb 17, 2015 · By Herb Reiter DesignCon’s 2015‘s tag-line “where the chip meets the board”, was a very appropriate message, and summarized in a few words...
Why is it Taking so Long to Ramp Interposer and 3D IC Designs?Jan 14, 2015 · By Herb Reiter And what are we going to do about it in 2015…? A moment ago I finished reading my predictions for...
IEDM 2014 3D Short Course Highlights 3D Memory Cubes for SYSTEM designJan 05, 2015 · By Herb Reiter Years ago, when I gave my first 3D technology presentations, I noticed very different reactions from my diverse audience: The...
3D ASIP 2014: All Aboard the 3D IC Train!Dec 22, 2014 · By Herb Reiter Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual...