Meeting Sustainability Goals Hits Political and Technical Headwinds
Feb 26, 2025 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 10
Highlights of the 23rd TSMC Symposium
On March 15, 2017, TSMC held its 23rd Symposium, based on popular request, at the Santa Clara Convention Center. I...
13th 3D ASIP Conference Demonstrates Manufacturer’s Commitment
The 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference is one of the biggest (if not THE biggest)...
IEDM 2016 Demonstrates Device Physics For The Semiconductor Industry
In the past few months I have been reading a lot of depressing news about our semiconductor industry’s declining growth...
Pasadena offers Roses and Technology
California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It...
TSMC’s OIP Symposium 2016
After a fairly long vacation it’s very hard to get back to work. That’s why I was really glad that...
The Great Divide Between Semiconductor Design and Manufacturing
Shortly before the summer break started, I attended a number of industry conferences: MEPTEC, ECTC, DAC, MEMS & Sensors, ASME...
DAC 2016: There is More to Life than IC Design, Part 2
Part 1 of my DAC 53 reporting focused on this year’s really impressive keynotes, now posted on the DAC website,... DAC 2016: There is More to Life than IC Design
In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that...
Looking Beyond the Components Horizon at ASME’s IoT Connect.
Every time someone asks me how my years experience I have, I tend to get evasive or try to turn...
Transforming Today’s Semiconductor Industry Challenges into Tomorrow’s Opportunities
My wife, born and raised in Hong Kong, tells me that the Chinese language uses the same word for challenge...
22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead
Earlier this week I had the opportunity to attend this year’s TSMC Symposium. Just like in many previous years, TSMC...
HBM Supply Chain Seminar Highlights System-level Advantages
The Computer History Museum in Mountain View is a very impressive place to show you the enormous progress ICs and...
DesignCon 2016: Where the Chip meets the Board and Great Ideas Come to Life
DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to watch the preparation work...
‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial
While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents,...
IC Packaging: An Essential Enabler and Differentiator, Part 2
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1. Wednesday morning started with a IC...
IC Packaging: An Essential Enabler and Differentiator, Part 1
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major...
Takeaways from the 5th Annual IEEE Global Interposer Technology Workshop
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC...
Interposers, 3D TSVs, and Alternatives: One Size Does Not Fit All
Whenever Francoise organizes an event, she always manages to compose a mixture of entertainment, real work and valuable education. This...
TSMC’s Grand Alliance: A Powerful EcoSystem
On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress...
