Nuclear is Out. How Do We Solve the High Tech Sustainability Problem?
Nov 20, 2024 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 10
DAC 2016: There is More to Life than IC Design, Part 2
Part 1 of my DAC 53 reporting focused on this year’s really impressive keynotes, now posted on the DAC website,... DAC 2016: There is More to Life than IC Design
In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that...
Looking Beyond the Components Horizon at ASME’s IoT Connect.
Every time someone asks me how my years experience I have, I tend to get evasive or try to turn...
Transforming Today’s Semiconductor Industry Challenges into Tomorrow’s Opportunities
My wife, born and raised in Hong Kong, tells me that the Chinese language uses the same word for challenge...
22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead
Earlier this week I had the opportunity to attend this year’s TSMC Symposium. Just like in many previous years, TSMC...
HBM Supply Chain Seminar Highlights System-level Advantages
The Computer History Museum in Mountain View is a very impressive place to show you the enormous progress ICs and...
DesignCon 2016: Where the Chip meets the Board and Great Ideas Come to Life
DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to watch the preparation work...
‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial
While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents,...
IC Packaging: An Essential Enabler and Differentiator, Part 2
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1. Wednesday morning started with a IC...
IC Packaging: An Essential Enabler and Differentiator, Part 1
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major...
Takeaways from the 5th Annual IEEE Global Interposer Technology Workshop
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC...
Interposers, 3D TSVs, and Alternatives: One Size Does Not Fit All
Whenever Francoise organizes an event, she always manages to compose a mixture of entertainment, real work and valuable education. This...
TSMC’s Grand Alliance: A Powerful EcoSystem
On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress...
Ideas for Co-optimizing Chip-Package Design
In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC...
With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these...
SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and...
DAC 2015 Focuses on the Automotive Market
By attracting 7011 EDA and IP developers and users, the 52 Design Automation Conference, held in the South Hall of San...
ECTC 2015: From the Tech Sessions Part 2
As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I...
1551 Industry Experts Demonstrate at ECTC: IC Packaging Technology is Essential for Success
Last week I attended the record-breaking 65th ECTC in San Diego: 20 percent more attendees, compared to last year’s conference...
