What You Need to Know About PFAS
Feb 19, 2025 · By Julia Freer · Blogs, From Different Dimensions
3D In Context View all
Heterogenous Integration at ISS: A Key Part of High-Performance Compute
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...
Asia May Still Be the Hottest Spot for Advanced Packaging
When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either...
SEMI ISS 2025: Ready, Set, Ramp!
The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid a boom year in 2022. The slowdown in 2023 had some resetting the dates for when the industry would crest the 1 trillion mark. The AI boom of 2024 has...
3D Integration Themes Become a Reality at IEDM 2024
The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off and on for 30ish years. If you are in the semiconductor process side of the world, this is one of the better conferences to attend to get up to speed...
Francoise in 3D View all
Announcing the Winners of the 2025 3D InCites Awards
As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply chain becomes more important than ever. So, when the 3D InCites Member Advisory Board reviewed this year’s finalists for the 2025 3D InCites Technology Enablement...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...
The 3D InCites Podcast Backtrack – 2024 in Review
Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack – a recap of your stats, including the top performing episodes. So we thought we’d share it with you, our listeners and sponsors, to give you...
Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024...
From Different Dimensions View all
The “White House of Microelectronics Packaging” Celebrates Its 15th Anniversary!
By Juliana Panchenko and Frank Windrich, Fraunhofer IZM-ASSID 15 years ago, Fraunhofer established the “White House of microelectronics packaging”— a leading-edge research center for 3D integration and advanced wafer-level packaging on 200/300mm wafer sizes. It was founded based on visionary ideas in the field of microelectronic packaging from the former...
US-JOINT Consortium: Strengthening Advanced Packaging Innovation Across Borders
As global semiconductor demand continues to surge, international collaboration has become essential for driving technological innovation. The US-JOINT consortium represents a key initiative in fostering cross-border cooperation between Japan and the United States. This groundbreaking collaboration brings together 10 companies- Azimuth Industrial Co. Inc., KLA Corp., Kulicke & Soffa Industries...
Empowering the Future: New York’s Semiconductor Industry Surge
In 2024, New York’s semiconductor industry experienced substantial growth, driven by increased funding from both the U.S. government and the expansion of IBM along with other key industry suppliers. As a result of these recent public and private initiatives, the NY CREATES’ Albany NanoTech Complex—the largest non-profit semiconductor R&D facility...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging, process control, and inspection solutions, while various acquisitions strengthened the U.S. semiconductor supply chain. There were various new hiring opportunities across the industry, upcoming conferences, and notable achievements. Innovation and...
Interconnectology 101 View all
Navigating the Shortage of Semiconductor Engineers: Tips from the Experts
You may have heard that for the semiconductor industry to reach $1 trillion, it needs around one million new workers globally. This includes entry level talent, technicians, supporting roles like accounting and human resources, and of course, semiconductor engineers. As it stands, no single industry has ever reached $1 trillion...
How Arizona is Growing its Advanced Packaging Capabilities
An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub for advanced packaging innovation. The year 2022 was monumental for the semiconductor industry. That year, the Biden-Harris administration committed to making the U.S. a world leader in semiconductor manufacturing by...
It’s Time to Put AI’s Growth Into Perspective
These days, it seems like artificial intelligence (AI) is taking over the world. In the last two years alone, we’ve seen the rise of ChatGPT, autonomous vehicles, Google Gemini, deep fakes, and my least favorite – soulless AI art. With so many new applications coming into focus, it can feel...
What to Know Before Buying an IMAPS Academy Course
If you’re new to the advanced packaging industry, it may have crossed your mind to invest in a professional development course. IMAPS, or the International Microelectronics Assembly and Packaging Society, offers exactly that. Their packaging-specific, IMAPS Academy courses are aimed at promoting a stronger understanding of key parts of the...
Packaging IFTLE View all
IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3
Multi-die systems are driving the need for standardized die-to-die interconnects. Several industry alliances have come together to define such standards: Optical Interface Forum (OIF) – The XSR and USR physical layer specifications optimized for die-to-die connectivity Chips Alliance – The AIB specification which was originally introduced by Intel Open Compute...
IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked dynamic random access memories (DRAMs) for high bandwidth memory (HBM) components. According to reports, the company is now considering entering the OSAT market by way of a strategic partnership with...
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The new platform relies on TSMC’s CoWoS and other advanced packaging technologies. It will allow designers to build system-in-packages (SiPs) of 3D-stacked logic,...
IFTLE 615: TSMC Evolves CoWoS Technology Promising 9x Reticle Size by 2027
TSMC recently announced at its Open Innovation Platform (OIP) Ecosystem Forum in Europe that its chip-0n-wafer-on=substrate (CoWoS) packaging technology will achieve certification by 2027, introducing a version with 9x reticle size. This will allow twelve HBM4 memory stacks, providing unprecedented performance enhancements for artificial intelligence (AI) and high-performance computing (HPC)...
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Sustainability 101: 2025 and Progress Toward Sustainability Goals
Happy New Year 2025. How are those 2030 sustainability goals coming along? If you committed to 2025 goals, are you...
2024: A Year of Growth and Innovation
2024 was another year of significant growth for Trymax Semiconductor Equipment B.V. This year was marked by several pivotal developments,...
December Member News: Celebrating Progress and Achievements
Despite being the holiday season for much of the world, many of our members have made remarkable progress and celebrated...
IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day
Intel Reaches The Fork in the Road Digitimes had some interesting recent opinions about the future of Intel. Let’s take...
Sustainability 101: How Green is Your Electricity?
Where does the energy come from to power your facilities? Even if your company claims to be 100% renewable energy,...
Semiconductor Industry Forecast: Looking Forward to Balanced Growth in 2025
As the semiconductor industry moves into the last month of 2024, industry pundits are looking back and then looking forward...
November 3D InCites Member News: Advancements and Milestones
This month has been full of exciting advancements and milestones for our members. From cutting-edge technological breakthroughs and prestigious award...
IFTLE 613: Solder Joint Reliability of Glass Core Substrate Assemblies
We have seen considerable global activity focused on developing glass core substrate assemblies and interposers, yet, as some of us...
IFTLE 612: Congratulations to the IMAPS 2024 Society Award Winners
Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of...
Nuclear is Out. How Do We Solve the High Tech Sustainability Problem?
The past 2 weeks have been a whirlwind of activity in high tech sustainability. We’ve moved from using nuclear power...
IFTLE 611: Amkor Clarifies Arizona Facility Activity
Wolfspeed & Hemlock Semiconductor Get Their CHIPS Act Share Arizona Facility to Focus on High Performance Computing In IFTLE 577...
Making Connections at SEMICON Europa 2024
Let’s be honest. When we get home from a trade show like SEMICON Europa 2024, it’s not all the presentations...
Sustainability 101: Let’s Talk Supply Chain
My blog post for November is about supply chains and sustainability. I’ll get to that, but first, I want to...
The Funds Keep on Rolling for CHIPS for America R&D
The CHIPS Act continues to issue grants to help advance the United States position in semiconductor and advanced technology. Two...
The Evolution of Interconnects in Microelectronics Packaging
Semiconductor packaging is a complex and evolving field, involving multiple disciplines. As a microelectronics packaging engineer, I focus on the...
Picking up the Pace of Panel-level Advanced Packaging at Onto Innovation
How A Collaborative Partnership Is Accelerating PLP Innovation Panel-level advanced packaging technologies have been in development for more than a...
From Words to a World of Chips: My Experience with IMAPS and The International Symposium
Recently, I worked on a grant proposal for the International Microelectronics and Packaging Society (IMAPS) Academy, as part of the...
October 2024 Member News
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
IFTLE 610: Looking for Silicon Interposers? Try GlobalFoundries!
If you have been looking for reliable, dependable sources of silicon interposers in anything beyond prototype quantities – like I...
