Sustainability 101: Making Sense of Sustainability Reporting Requirements
Mar 20, 2025 · By Julia Freer · Blogs, From Different Dimensions
3D In Context View all
Artificial Intelligence is Driving Panel Level Packaging
An Intel engineer holds a test glass core substrate panel at Intel’s Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company’s Assembly and Test Technology Development factories. (Credit: Intel Corporation) TSMC has announced a roadmap to 9...
Meeting Sustainability Goals Hits Political and Technical Headwinds
Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration has yet again pulled out of the Paris agreement, and has a campaign promise of “Drill baby, drill!”. However, the United States is not alone in the challenges of keeping...
Heterogenous Integration at ISS: A Key Part of High-Performance Compute
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...
Asia May Still Be the Hottest Spot for Advanced Packaging
When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either...
Francoise in 3D View all
Will the CHIPS ACT Be “DOGE’d?” And Other Musing from IMAPS Device Packaging 2025
There was a lot to be enthusiastic about at IMAPS Device Packaging 2025 (DPC2025). We presented the 2025 3D InCites Awards to eight deserving winners. We donated $70K to the IMAPS Microelectronics Foundation to establish a college fund for women and under-represented minorities seeking a career in microelectronics. Now in...
Announcing the Winners of the 2025 3D InCites Awards
As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply chain becomes more important than ever. So, when the 3D InCites Member Advisory Board reviewed this year’s finalists for the 2025 3D InCites Technology Enablement...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...
The 3D InCites Podcast Backtrack – 2024 in Review
Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack – a recap of your stats, including the top performing episodes. So we thought we’d share it with you, our listeners and sponsors, to give you...
From Different Dimensions View all
Industry Trade Shows and Conferences Strengthen Partnerships and Influence Product Innovation
Conferences and industry trade shows have been the cornerstone of professional networking and educational advancement for as long as I can remember. More than 20 years ago, I attended my first semiconductor event, the Solid State Sensors & Actuators Conference (called Hilton Head 2002), and have been participating ever since....
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and notable leadership updates. From breakthrough product launches and major acquisitions to industry collaborations, here’s a look at what our members achieved this month. Technology Innovation and Product Developments Nordson Electronics...
Bridging the Semiconductor Talent Gap – The Role of the European Chips Act and Beyond
The European Chips Act (ECA) is pivotal to Europe’s strategy for technological sovereignty, aiming to strengthen the continent’s semiconductor supply chain and foster innovation. However, a key obstacle remains: the projected shortfall of 350,000 semiconductor professionals by 2030. Addressing this semiconductor talent gap is critical for the ECA’s success and...
What You Need to Know About PFAS
You have probably heard about health and environmental concerns related to per- or polyfluoroalkyl substances (PFAS). Companies are being pressured to replace PFAS with safer alternatives for nonstick coatings, water-resistant fabrics, firefighting foams, and more to meet upcoming restrictions. For manufacturers, including those in the semiconductor industry, PFAS replacement is...
Interconnectology 101 View all
The Role of AI-Powered 3D X-Rays for Advanced Packaging Test Applications
Semiconductors power AI, AI powers semiconductor manufacturing, and the cycle continues indefinitely. But one area where AI is making a particularly noteworthy contribution is for the test phase of advanced packaging. With advancements in AI, manufacturers can find and address defects within their processes faster than ever, allowing them to...
Navigating the Shortage of Semiconductor Engineers: Tips from the Experts
You may have heard that for the semiconductor industry to reach $1 trillion, it needs around one million new workers globally. This includes entry level talent, technicians, supporting roles like accounting and human resources, and of course, semiconductor engineers. As it stands, no single industry has ever reached $1 trillion...
How Arizona is Growing its Advanced Packaging Capabilities
An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub for advanced packaging innovation. The year 2022 was monumental for the semiconductor industry. That year, the Biden-Harris administration committed to making the U.S. a world leader in semiconductor manufacturing by...
It’s Time to Put AI’s Growth Into Perspective
These days, it seems like artificial intelligence (AI) is taking over the world. In the last two years alone, we’ve seen the rise of ChatGPT, autonomous vehicles, Google Gemini, deep fakes, and my least favorite – soulless AI art. With so many new applications coming into focus, it can feel...
Packaging IFTLE View all
IFTLE 621: TSMC Chip and Package Activity in the U.S.
Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm process. Monthly capacity is expected to reach 30,000 wafers by mid-year. Construction of Fab 21 Phase 2 and Phase 3 are set to proceed this year and next, with fab...
IFTLE 620: Micross Acquires Integra; Hynix HBM booked through 2025
Micross, a portfolio company of Behrman Capital, announced on January 15, that it has acquired Integra Technologies, headquartered in Wichita, KS. Since both are privately owned, the exact amount that Micross paid to acquire Integra Technologies hasn’t been publicly disclosed in the available sources. Micross Components makes microelectronic components for...
IFTLE 619: CHIP Flagship Facilities include Albany NY, Sunnyvale CA and Tempe AZ
CHIPS for America has announced three anticipated CHIPS for America research and development (R&D) flagship facilities. These state-of-the-art CHIP flagship facilities will establish world-class advanced semiconductor R&D in the United States. “They will address critical gaps in the current ecosystem, offering unparalleled value to a diverse array of stakeholders across...
IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3
Multi-die systems are driving the need for standardized die-to-die interconnects. Several industry alliances have come together to define such standards: Optical Interface Forum (OIF) – The XSR and USR physical layer specifications optimized for die-to-die connectivity Chips Alliance – The AIB specification which was originally introduced by Intel Open Compute...
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The “White House of Microelectronics Packaging” Celebrates Its 15th Anniversary!
By Juliana Panchenko and Frank Windrich, Fraunhofer IZM-ASSID 15 years ago, Fraunhofer established the “White House of microelectronics packaging”— a...
US-JOINT Consortium: Strengthening Advanced Packaging Innovation Across Borders
As global semiconductor demand continues to surge, international collaboration has become essential for driving technological innovation. The US-JOINT consortium represents...
Empowering the Future: New York’s Semiconductor Industry Surge
In 2024, New York’s semiconductor industry experienced substantial growth, driven by increased funding from both the U.S. government and the...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
Sustainability 101: 2025 and Progress Toward Sustainability Goals
Happy New Year 2025. How are those 2030 sustainability goals coming along? If you committed to 2025 goals, are you...
SEMI ISS 2025: Ready, Set, Ramp!
The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid...
2024: A Year of Growth and Innovation
2024 was another year of significant growth for Trymax Semiconductor Equipment B.V. This year was marked by several pivotal developments,...
IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked...
3D Integration Themes Become a Reality at IEDM 2024
The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off...
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI...
December Member News: Celebrating Progress and Achievements
Despite being the holiday season for much of the world, many of our members have made remarkable progress and celebrated...
IFTLE 615: TSMC Evolves CoWoS Technology Promising 9x Reticle Size by 2027
TSMC recently announced at its Open Innovation Platform (OIP) Ecosystem Forum in Europe that its chip-0n-wafer-on=substrate (CoWoS) packaging technology will...
IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day
Intel Reaches The Fork in the Road Digitimes had some interesting recent opinions about the future of Intel. Let’s take...
Sustainability 101: How Green is Your Electricity?
Where does the energy come from to power your facilities? Even if your company claims to be 100% renewable energy,...
Semiconductor Industry Forecast: Looking Forward to Balanced Growth in 2025
As the semiconductor industry moves into the last month of 2024, industry pundits are looking back and then looking forward...
Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the...
November 3D InCites Member News: Advancements and Milestones
This month has been full of exciting advancements and milestones for our members. From cutting-edge technological breakthroughs and prestigious award...
IFTLE 613: Solder Joint Reliability of Glass Core Substrate Assemblies
We have seen considerable global activity focused on developing glass core substrate assemblies and interposers, yet, as some of us...
IFTLE 612: Congratulations to the IMAPS 2024 Society Award Winners
Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of...
