Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing
Feb 12, 2018 · By Eric Beyne · Blogs, From Different Dimensions, R&D and Collaboration
Latest Posts - Page 2
MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
MonolithIC 3D Inc., a Silicon Valley startup, announced today that the USPTO has issued MonolithIC 3D three additional patents on monolithic...Amkor Technology Licenses Proprietary Through Mold Via Technology to SHINKO
Amkor Technology, Inc. provider of semiconductor packaging and test services, has granted SHINKO Electric Industries Co, Ltd. a non-exclusive license...At Fraunhofer IZM-ASSID, It’s All Silicon, All the Time
One of 60 research institutes that make up Germany’s Fraunhofer Gesellschaft, the Fraunhofer Institute for Reliability and Microintegration IZM is...SUSS MicroTec launches RCD8: The new Resist Coat and Develop Platform
SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor and related markets, launched the RCD8, a new...NEXX Systems Joins Tokyo Electron (TEL) as a Wholly Owned Subsidiary
Tokyo Electron Limited announced the completion of a definitive acquisition agreement with NEXX Systems Inc. Over the years, NEXX collaborated...Applied Materials and A*STAR’s Institute of Microelectronics to Drive Advanced 3D Chip Packaging with World-Class R&D Lab in Singapore
Applied Materials Inc. and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research...Tezzaron Acquires Texas Semiconductor Facility
Tezzaron Semiconductor has signed a contract to purchase the assets of a semiconductor technology development and wafer fabrication facility in...Soitec announces successful completion of acquisition of Altatech Semiconductor
Soitec announced the successful completion of its acquisition of all of the outstanding shares composing the capital of Altatech Semiconductor S.A., a...MonolithIC 3D Inc. Issued 5th Patent on 3D IC Technology
MonolithIC 3D Inc., a Silicon Valley startup, announced today that it has been issued its fifth patent on monolithic 3D-IC...Europe Targets Leadership in Next-Generation “Smart Systems”
The partners in a new European research project today announced details of the multinational/multidisciplinary 'SMArt systems Co-design' (SMAC) program. This...
