Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing
Feb 12, 2018 · By Eric Beyne · Blogs, From Different Dimensions, R&D and Collaboration
Latest Posts
3D InCites Interview: RTI in 3D
While most of the research institutes in the US and Asia have been focused on commercializing 3D integration technologies for...
Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
Nano Utica gets $1.5B Infusion; Probably Good Die Revisited; Developments in Monolithic 3D
Word on the street is, New York will soon be known as Nano York, with all the money the state...
Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium
I admit, I always have my 3D glasses on at conferences. But even though the title of this week’s MEPTEC...
Dow Corning offers the Power of Silicone Technology
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview...
Interview with Fraunhofer IZM-ASSID’s Juergen Wolf: The Collaboration Grows
A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed...
EV Group: Never a Dull Moment
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with...
Interview with imec’s Ludo Deferm: Packaging Design Kits and Debond Solutions
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought...
Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization...
2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on...
EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013
Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST,...
Semi Trade Pubs Talk 3D, Just in time for SEMICON West
That Jan Vardaman, she’s so clever! I just finished reading her column on ECTC 2013 in Printed Circuit Design and... New Consortium for 2.5D Through-silicon Interposer Technology to Benefit Computer and Consumer Electronics Industries
A*STAR Institute of Microelectronics and Leading Semiconductor Partners combine research and market expertise to address industry challenges Singapore, 24 June...
2.5D Products and 3DIC Standards and Roadmaps Are On the Move
Naysayers be damned! Full commercialization for 3D ICs in smartphones may be a few years out, but that doesn’t dampen...
3D IC Reality Check
The good news: While forecasted dates for 3D IC volume manufacturing continues to be pushed out, clearly foundries and OSATS are...
