The Role of Chiplets in Redefining Semiconductor Design
Dec 05, 2024 · By Cadence · 3D In-Depth, Design
Design View all
Five Workflows for Tackling Heterogeneous Integration of Chiplets for 2.5D/3D
Keeping pace with Moore’s law continues to be challenging and is driving the adoption of innovative packaging technologies that support continued system scaling while doing so at lower costs than comparable monolithic devices. These packaging technologies disaggregate what would typically be a homogenous, monolithic device — like an ASIC or...
A Focus on Chiplet Verification
Chiplets have become a strategic asset for designers who are implementing them in all sorts of applications. Until now, chiplet verification until now has been overlooked. I discussed this phenomenon with Dave Kelf, CEO of Breker Verification Systems, an ESD Alliance member company and provider of verification solutions that leverage...
Devices View all
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
Latest Posts - Page 7
Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)
Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)At SEMICON West 2016, the big story was the end of...
What is Driving the Growth of the Glass Material Market in Semiconductor Manufacturing?
Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role...
Announcing the Winners of the 2017 3D InCites Awards!
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as...
Tech Session Highlights from ECTC 2017
Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as...
Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP
For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly...
Artificial Intelligence: A New Era of the Advanced Packaging Industry
Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV &...
The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory
Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years...
Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA
The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very...
Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices
More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is...
Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions
“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging...
3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition
In less than two weeks, the 13th Annual Architectures for Semiconductor Integration and Packaging Conference (3D ASIP) kicks off at...
What’s New for the 2017 European 3D Summit
For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over...
MEMS & Sensors Industry Group Reveals Tech Showcase Finalists
MEMS & Sensors Industry Group (MSIG)’s annual MEMS & Sensors Technology Showcase at MEMS & Sensors Executive Congress® 2016 (November...
SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging
System integration is moving forward. Denser and high performing systems require advanced packaging, assembly, and test players to move closer...
What is Driving the Advanced Packaging Market in China?
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced...
Meet Me at ECTC 2016 in Las Vegas
With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies...
Convergence on the “Big Five”: Focus on WLCSP
Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially,...
What to Expect on 3D Integration and IoT at the 2016 Symposium on VLSI Technology
If you’re planning to attend this year’s combined Symposium on VLSI Technology and Circuits, themed “Inflections for a Smart Society,”...
Advanced Packaging and 3D come to MRS Spring Meeting
For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never...
