Chiplet Test: Piecing Together the Next Generation of Chips (Part 2)
Jul 09, 2024 · By Erik Jan Marinissen · 3D In-Depth, Test and Inspection
CMP/CMC/MOSIS announced a Grenoble-France based partnership for a 3D-IC multi-project wafer (MPW) service based on Tezzaron’s SuperContact technology and...
French research insitute, CEA-Leti and Docea Power, developers of software for power and thermal analysis at the architectural level,...
New System Provides World-class Alignment Technology at an Affordable Cost
In this post written and submitted by John H. Lau, Electronics & Optoelectronics Laboratory, ITRI, the true inventor of...
Embedded wafer level ball grid array (eWLB) technology has been a hot topic lately on 3D InCites, what with...
Semiconductor test and advanced packaging service provider (SATS) STATS ChipPAC announced it has has expanded embedded Wafer-Level Ball Grid...
3D Workshop organizers Erik Jan Marinissen (IMEC), Yann Guillou (ST-Ericsson) Geert Van der Plas (IMEC) report back from a...