Multi-Tier Die Stacking Enables Efficient Manufacturing
Oct 16, 2024 · By Jessica Albright · 3D In-Depth, Materials
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Digital and Physical: Thermal Twins for Developing Thermal Management Solutions
As we all know, finding thermal management solutions is becoming an increasingly critical but also an ever more challenging issue...
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Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
Materials Science Solutions for Electronics Sustainability
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Development of Innovative Advanced Packaging Materials for System in Package
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Glass-based Solutions for Packaging are Here
A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring...
Increasing the Conductive Density of Power Packaging
March 3, 2021 – Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such...
RF Technology in a Complete Glass Package
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Temporary Bonding and Debonding Technologies for Fan-out Wafer-Level Packaging
Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within...
What is Driving the Growth of the Glass Material Market in Semiconductor Manufacturing?
Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role...
Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions
“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging...
Advanced Packaging and 3D come to MRS Spring Meeting
For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never...
Dow Corning: Thermally Conductive Gel TC-3040
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SOLDERON™ BP TS 6000 Tin-Silver is a lead-free chemistry for solder bump applications. From a single formulation, it is capable... Indium Corporation: Wafer Flux WS-3543
Indium Corporation’s wafer bumping flux WS-3543 is a low-viscosity semiconductor-grade flux, specifically optimized for uniform solder bump formation across wafers...
Dynaloy: Dynastrip DL9150
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Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?
On one side of the fence, we have semiconductor device manufacturers (fabs, foundries, and OSATS) claiming to be ready to...
A Solder Bump Expert’s Take on the Expanding World of Advanced Packaging
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