How AiP Technology Helps Enable 5G and More
Jun 04, 2020 · By Amkor Technology · 3D In-Depth, Devices
Latest Posts - Page 3
Update on 3D transistors (That “other” 3D)
I always hesitate to cove 3D transistors, because before they came along, I only focused on what I knew to...IMAPS 2012 3D Tweeture Double Feature – Part 1
I spent this whole week at IMAPS 2012 in San Diego, and tweeted live from the event. Sometimes in the...SEMICON Europa 2012 Focuses on Materials, 3D ICs, and 450mm
SEMICON Europa got underway yesterday, and reports from the event point to new materials, 450mm and 3D ICs as the...When 3D is 3D IC, and When it’s Not
Some of the best news to read (especially on a Friday) is non-news, like this report by Ann Steffora Mutschler,...Today in 3D: HMCC Drafts Specs; Materials Suppliers take on TB/DB; OSATS add Capacity
I’ve come across a few interesting announcements in the 3D space today that separately are just random bits of news,...An Incomplete List of 3D Solutions
We read a lot about the remaining challenges to be addressed before 3D ICs are fully commercialized. Current roadmaps are...Ziptronix Takes on 3D Memory
After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development...Why Wait Until 2016? Invensas Introduces A Bridge to Mobile Wide IO
We’ve all heard it: Wide I/O DRAM on Logic using TSV interconnects will be THE solution for achieving the high...3D Company Updates
There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw...Ziptronix Direct Oxide Bond Technology Gains Momentum
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the...
