How AiP Technology Helps Enable 5G and More
Jun 04, 2020 · By Amkor Technology · 3D In-Depth, Devices
Latest Posts
The Invention of NAND Flash Memory
Part 3 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the invention of...
The Invention of Tunneling-Based Flash Memory
Part 2 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with a history...
Fan-out Packaging Confirms its Success Story
Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain...
The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory
Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years...
Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices
More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is...
Can 3D Super-NAND Improve Cost-per-Bit for 3D NAND?
The 3D NAND floodgates just opened a little wider with today’s announcement from BeSang that it has developed 3D Super-NAND...
Amkor: SLIM
Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level...
Xilinx: Ultrascale VU440 3D FPGA
The Xilinx Ultrascale VU440 3D FPGA is constructed using “Xinterposer” 3D IC technology jointly developed by Xilinx and TSMC. It...
Omnivision: OV23850 PureCel Image Sensor
OmniVision’s OV23850 PureCel image sensor utilizes the companies advanced stacked die process capture exceptional images and video in 23.8-megapixel resolution...
Executive Viewpoint: Invensas Opens its Toolbox of Interconnect Options
We’ve heard it expressed many times whenever there’s a new interconnect technology vying for adoption: manufacturers will select the best...
Ye Antique Towers – Samsung’s 3D NAND Flash SSD 850 Pro
Samsung’s introduction of its 3D NAND Flash SSD 850 Pro has led to the inevitable hullabaloo. Amid all the fuss, it hasn’t...
Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory Inside
Somehow in all my preparations for the 2014 3D InCites Awards and planning the schedule for SEMICON West this week,...
SORIN CRM: 3D IC Module for Active Medical Implant
Manufacturing of 3D IC heterogeneous integrated modules for the electronics of a leadless pacemaker in a very small volume has... Schiltron 3D Flash
Schiltron 3D Flash replaces 2D-NAND. It uses a unique architecture solving key challenges associated with other 3D-NAND approaches: scalable; no... Novati Technologies: Silicon Interposer Module
The 2.5D Interposer Module features three front-side interconnect layers of dual-damascene copper on top of a single-damascene copper metal layer,...
3D NAND Flash – Schiltron’s Answer
It probably appears that the only 3D technologies vying for 2D NAND’s crown are V-NAND from Samsung and p-BiCS from...
3D NAND Flash – Towering Spires or Costly Canyons? – Part 4
If you’ve followed me thus far in the three preceding posts, well done! We started by questioning the cost assumptions....
Part 2: 3D NAND Flash: Towering Spires or Costly Canyons?
In my last blog posting I went over the cost aspects of the Samsung-Toshiba 3D NAND approaches. The conclusion is...
What Node Names Really Mean; The TB/DB Saga continues; HMC update
Did you know that when foundries talk about 14nm and 16nm node chips, these devices are in reality no denser...
