Expanding the Chiplet Market: Processing Any Wafer from Any Foundry Jul 30, 2024 · By Sylvie Joly · 3D In-Depth, Applications
Autonomous Vehicles Drive AI Advances for Edge Computing Jul 22, 2021 · By Manouchehr Rafie, Ph.D. · 3D In-Depth, Applications
48V Ecosystem and Power Packaging Trends Sep 21, 2020 · By Ajay Sattu · 3D In-Depth, Applications, Processes and Technology
Artificial Intelligence: A New Era of the Advanced Packaging IndustryJun 08, 2017 · By Yole Development · 3D In-Depth Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV &...
The Future of Image Sensors is Chip StackingSep 15, 2014 · By Francoise von Trapp · 3D In-Depth CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However, this is not really...
3D App UpdateJan 17, 2013 · By Francoise von Trapp · 3D In-Depth Because someday soon, we will find more 3D TSV devices than just CMOS image sensors inside mobile applications, I like...
This Week in 3D IC News (Oct 8-12)Nov 10, 2012 · By Francoise von Trapp All Programmable PlanetToday All Programmable Planet’s newsletter appeared in my inbox, with a great post by Max Maxfield on the...
Important stuff – but first, some 3D Friday funOct 19, 2012 · By Francoise von Trapp · 3D In-Depth Fridays just kind of creep up on you, don’t they? It’s been a busy week in the 3D blogosphere –...
EV Group’s GEMINI Wafer Bonding System First to Pass Equipment Maturity Assessment within SEMATECH’s Interconnect and Manufacturability ProgramOct 07, 2012 · By Francoise von Trapp · 3D In-Depth SEMICON West, San Francisco, Calif., July 10, 2012 — EV Group (EVG), a leading supplier of wafer bonding and lithography...
3D in the iPhone 5 and Other Teardown DiscoveriesSep 25, 2012 · By Francoise von Trapp · 3D In-Depth “It’s just like peeling a banana” reads the caption on one teardown photo describing the careful dissection of the iPhone...
Apple iPhone 5 Teardown; More on FinFets; Thoughts on 3D Test; (and some Friday Fun at the End)Sep 21, 2012 · By Francoise von Trapp · 3D In-Depth Somehow the social media “shares” on Friday are more lighthearted than the rest of the week. Today, all the excitement...
When 3D is 3D IC, and When it’s NotAug 24, 2012 · By Francoise von Trapp · 3D In-Depth Some of the best news to read (especially on a Friday) is non-news, like this report by Ann Steffora Mutschler,...
Ziptronix Takes on 3D MemoryJun 06, 2012 · By Francoise von Trapp · 3D In-Depth After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development...
Glass vs. Silicon Interposers for 2.5D and 3D IC ApplicationsMar 20, 2012 · By Francoise von Trapp · 3D In-Depth There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with...
Perspectives on 3D Integration: The ResearchersOct 13, 2011 · By Francoise von Trapp · 3D In-Depth To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for...
IMEC Tech Forum Looks at Smartphones Today and in the FutureJul 25, 2011 · By Francoise von Trapp · 3D Event Coverage In this brave new world powered by consumer electronic devices that cater to the user experience, smartphones and tablets are...
Thermocompression Bonding for Microbump Flip Chip SolderingJul 19, 2011 · By Francoise von Trapp · 3D In-Depth An excerpt from the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation's Semiconductor and Advanced...
3D: You’ve Come a Long Way Baby!Feb 16, 2011 · By Francoise von Trapp · 3D In-Depth This column by Francoise von Trapp appeared in the Jan/Feb 2011 issue of Chip Scale Review It sums up a...