Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications
Apr 02, 2025 · By Nordson Test and Inspection · 3D In-Depth, Test and Inspection
Design View all
Taking 3D IC Heterogeneous Integration Mainstream
By Tony Mastroianni and Todd Burkholder, Siemens DIS Over the last several years, chiplet-based heterogeneous package integration has emerged as a promising alternative to traditional monolithic package solutions; the so-called homogenous SoC design. 3D IC heterogeneous integration is a system approach, wherein what typically would be implemented as an SoC...
The Role of Chiplets in Redefining Semiconductor Design
Chiplets are transforming the semiconductor landscape. Rather than relying on larger, all-in-one designs, chiplets offer a modular approach to chip manufacturing. By breaking down complex systems into smaller, reusable components, they address growing challenges in performance, scaling, and time-to-market. As Moore’s Law slows and the limits of monolithic systems on...
Devices View all
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
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