Unpacking AI’s Power-Hungry Demands
Dec 19, 2024 · By Jillian Carapella · 3D Event Coverage
Latest Posts - Page 7
Meet Me at ECTC 2016 in Las Vegas
With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies...
What to Expect on 3D Integration and IoT at the 2016 Symposium on VLSI Technology
If you’re planning to attend this year’s combined Symposium on VLSI Technology and Circuits, themed “Inflections for a Smart Society,”...
The European 3D Summit: From Roadmaps to Reality
In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected...
At 3D ASIP 2015, Variety is the Spice of Life
Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s...
The IPSO Alliance IoT Pavilion at Designers of Things Brings Smart Ideas to Life
Have you ever met someone who actually built a better mousetrap? What about someone who came up with the idea...
Executive Viewpoint: Why the European 3D Summit is Going Beyond TSVs
Remember back a few years ago when 3D and TSV were considered to be the pretty much the same thing?...
Questions Answered at the 2015 MEMS Executive Congress
This final post from my time at the 2015 MEMS Executive Congress addresses some random questions I had that were...
System-level Scaling: UCLA’s Answer to Extending Moore’s Law
“We are at a crossroads. Current chip design is nearing its capacity. The time, expense, and effort needed to make...
The IoT at SEMICON West 2015: We Just Can’t Get Enough
As a topic of much discussion and debate, the Internet of Things (IoT) stole the show once again, this time...
The 2015 3D InCites Guide to 3D at SEMICON West
2015 will go down in history as the year 3D finally got real. It’s not an emerging technology anymore, and...
ECTC 2015 Supplier Update
While Herb Reiter dove deep into the technology sessions at ECTC 2015, I spent most of my time picking the brains of suppliers...
ECTC 2015: From the Tech Sessions Part 2
As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I...
Will the Chip Industry Benefit from the Internet of Everything?
The Internet of Things (IoT) or as Cisco calls it, the Internet of Everything, has been the theme du jour for...
ECTC 2015: Advanced Packaging Sets Sail in San Diego
The 65th annual Electronics Technology Components Conference (ECTC 2015) logged record numbers (over 1500 attendees, 20% increase over last year) as...
What’s In Store for Attendees at ECTC 2015
ECTC 2015 returns to my favorite of its three rotating locations at the Sheraton San Diego Hotel and Marina almost exactly...
EDPS 2015 Looks At IC Innovations from the Design Perspective
On Thursday and Friday of last week, Monterey, California’s previous state capital, became the center of presentations and discussions about IC...
How Will Future Capex Spending Affect Semiconductor Suppliers?
At the recent Arizona SEMI Breakfast Forum, held April 17, 2015, semiconductor suppliers gathered at the Mother Ship (aka Intel) in Ocotillo,...
Addressing 3D IC Assembly Challenges at IMAPS DPC 2015
While we wait in the 3D IC holding pattern for products to go into high volume, processes continue to be...
SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology Cool
From March 16-20 the annual SEMI-THERM Conference (SEMI-THERM 2015) in San Jose gave me the opportunity to meet many assembly, materials,...
