Unpacking AI’s Power-Hungry Demands
Dec 19, 2024 · By Jillian Carapella · 3D Event Coverage
Latest Posts - Page 4
Virtual SEMICON West 2020: The Soft Launch
Whew! That was a busy two hours! Here’s a short blog post about my initial impressions of Virtual SEMICON West...
Virtual DAC 2020 Addresses Chiplets and Advanced Packaging
Why is attending Design Automation Conference (DAC 2020) important for 3D InCites readers? Two of my previous employers – National...
Zooming Into SEMICON West
This year, 3D InCites is zooming into SEMICON West, talking with our community to see how our members are handling...
What to Expect at Virtual SEMICON West 2020
This feels weird, folks. For the first time in 15 years, I didn’t board a flight bound for SEMICON West...
ECTC 2020 Online is Accessible at No Charge
When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging...
Your Guide to Getting the Most out of Virtual ECTC 2020
One silver lining to COVID 19 for the microelectronics and advanced packaging communities is the ability to attend virtual ECTC...
3D & Systems Summit Explores an Expanding Application Space
Back in 2013, when 3D through silicon via (3D TSV) technology was a hot topic, SEMI Europe created the European...
2020 IEEE International Reliability Physics Symposium Changed to Virtual Conference; New Date April 28
Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a...
3D InCites Community Members to Play Key Role at IMAPS DPC
What’s on the agenda for the 2020 IMAPS Device Packaging Conference (DPC)? So much, and too much to share it...
ISS 2020: How to Win in Our Data-driven World – Part 2
In Part 1 of my ISS 2020 blog, I described Monday’s opening keynote by LAM’s CTO, Richard Gottscho. He explained...
ISS 2020: How to Win in Our Data-driven World
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at...
IEDM 2019: Making Electronic Systems Smarter, Safer, and More Reliable
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference...
Talking about Neural Networks and SoC Design Challenges
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November...
Microtech Ventures brings a New MEMS and Sensors Summit to Town
From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation...
SEMICON Europa and Productronica 2019 Exhibitor Showcase
The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused...
Uniting the World Through Technology Innovation
What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend...
3D VLSI Open Workshop Showcases 3D IC Supply Chain Capabilities
Severine Cheramy, Director 3D Business Development, at CEA-Leti, recently brought key partners of Leti’s 3D-IC programs together at the 6th...
Products on Parade in the Exhibits at IWLPC 2019
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out...
SEMICON Europa on Preview…
Co-located with productronica in Munich, Germany, SEMICON Europa attracts and connects industry-leading technology companies from every segment of the European...
