SEMICON Korea 2025 Member Preview: Lead the Edge
Feb 06, 2025 · By Francoise von Trapp · 3D Event Coverage
Latest Posts - Page 15
SEMICON West to address critical trends in 3D IC and Advanced Packaging
The SEMICON West 2010 show at Moscone Center in San Francisco, from July 13-15, will present a full program of...Gearing up for IITC in 3D
This year’s 2010 IEEE International Interconnect Technology Conference (June 7-9, Burlingame, CA) has caught the 3D...DATE’10 3D Integration Workshop addresses applications, technology, architecture, design, automation, and test’
3D Workshop organizers Erik Jan Marinissen (IMEC), Yann Guillou (ST-Ericsson) Geert Van der Plas (IMEC) report back from a...
3D InCites’ Guide to Navigating theThird Dimension at SEMICON West
There’s no doubt about it, the 3D technology related workshops, lectures, and presentations happening at and around SEMICON West this...3D R&D Round-up: MIT Lincoln Labs works on SOI
At MIT Lincoln Labs (MITLL), R&D processes developing 3D chips using silicon-on-insulator (SOI) wafers is the sole focus. As Phil...TSV Seminar Looks Back to the Future of Etch
Attending last week’s TSV Seminar in Tokyo, hosted by Electronic Journal, posed a bit of a challenge as all but...Discussion Summary: Overcoming weaknesses in dry processes for TSV metallization
This week’s online forum with Alchimer’s executive team, Steve Lerner, CEO; Kathy Cook, Director...SUSS MicroTec workshop zeroes in on wafer thinning and handling issues
Last year, it was all about through silicon vias (TSVs), this year, it’s all about everything else needed to...
3d is hot at SEMICON West
Given the building momentum around 3D integration schemes and the attention it's getting as the semiconductor bright spot, it's...
At IMAPS 2009, IBM Bradley McCredie gets real about scaling
It looks like it’s time to throw in the towel on scaling. According to Bradley McCredie, Ph.D., IBM fellow and...
