Unpacking AI’s Power-Hungry Demands
Dec 19, 2024 · By Jillian Carapella · 3D Event Coverage
Latest Posts - Page 14
Leti’s Open 3D Targets Niche Market Players
Last week, CEA-Leti launched its Open 3D initiative to the 3D world in an effort to make its mature 3D...June Event Highlights in 3D
Note to self: no more graduations/college orientations/vacations in the month of June. There are way too many events in 3D...More from Hot Chips 2012
So thanks to a couple tweets from Jim Prior (@cavemanjim) who’s blog post was included in last week’s Hot Chips...Monday 3D Mash-up
For most of July I focused on coverage of SEMICON West in 3D. Today, I thought I’d take a look...Ziptronix CTO to Speak at RTI Meeting on 3-D Architectures For Semiconductor Integration and Packaging, Dec. 14
Paul Enquist, Ziptronix Inc.’s chief technology officer and vice president of R&D, will provide an update on direct bond technology...IMEC Tech Forum Looks at Smartphones Today and in the Future
In this brave new world powered by consumer electronic devices that cater to the user experience, smartphones and tablets are...ECTC 2011 – It’s a Small World After All
I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than...Leti’s 300mm 3D Launch Party
Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration,...IMAPS 3D Panel Presents United Front
Keith Cooper, Technology and Development, SET North America reports from 2010 IMAPS International , where he attended the 3D Panel,...3D R&D Round-up: Part 1: RTI International
At last month’s 3D Architectures for Semiconductor Integration and Packaging Conference, coordinated by RTI International, three government-funded research institutes...
R&D Round-up Part 2: CEA-Leti rolls out TSV and Non-TSV Demonstrators
Reporting progress for CEA-Léti was 3D program manager Mark...An In-Depth Look at Leti’s Common Lab with SPTS
When a research institute is evaluating different options for technology partnerships, what tips the scales in favor of one supplier...3-D chips and Evolving Test Strategies Take Center Stage at ITC
Program chair Erik Volkerink of Verigy discusses this year's International Test Conference in an interview with Rick Nelson, Chief Editor,...Prior Predictions
Every once in a while, it’s helpful to step back and get a broad view of what’s going on in...SEMICON West: Success for 3D –focused Companies
Is it mere co-incidence that companies who have invested in 3D technologies seem to have escaped the effects of the...ECTC 2010 Panel Examines the Medical Device Market
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond...SEMICON Singapore program features 3D InCites Partners
SEMICON Singapore gets underway next week (May 19-21), and the 3D track speaker line-up features...SEMICON West to address critical trends in 3D IC and Advanced Packaging
The SEMICON West 2010 show at Moscone Center in San Francisco, from July 13-15, will present a full program of...Gearing up for IITC in 3D
This year’s 2010 IEEE International Interconnect Technology Conference (June 7-9, Burlingame, CA) has caught the 3D...DATE’10 3D Integration Workshop addresses applications, technology, architecture, design, automation, and test’
3D Workshop organizers Erik Jan Marinissen (IMEC), Yann Guillou (ST-Ericsson) Geert Van der Plas (IMEC) report back from a...
