Unpacking AI’s Power-Hungry Demands
Dec 19, 2024 · By Jillian Carapella · 3D Event Coverage
Latest Posts - Page 13
Interconnectologists and Market Analysts See Eye to Eye on The Changing IC Industry at BiTS Workshop
Every year in early March, I spend a day at the BiTS Workshop (Burn-in Test Strategies), not because it’s a...
Viewing 3D IC Blossoms at SPIE Advanced Lithography 2013
Are you familiar with the Japanese custom of cherry blossom viewing? “Hanami (花見, lit. ‘flower viewing’) is the Japanese traditional custom...3D IC Blogosphere Update – Feb 22
Has it really been a month since the European 3D TSV Summit? This inaugural event certainly caused a buzz in...
3D IC Gets a Nod or Two of Encouragement at Common Platform Tech Forum 2013
Guest Blogger, Paul Werbaneth, shares his take-aways on 3D ICs at the last week’s Common Technology Platform There was little...
European 3D TSV Summit: But Wait, There’s More!
Day Two of the European 3D TSV Summit dawned bright and clear, with such a spectacular view of the nearby...
Alchimer Resurfaces at the European 3D TSV Summit
It had been awhile since I heard from the folks at Alchimer about the progress of electrografting (eG), its “all... European 3D TSV Summit: Focus on Cost of Ownership
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...
Inside the Gadgets at CES 2013
One of these days, I’m going to go to CES. Since 3D integration technology isn’t the focus of the show,...
More Tech Notes from 3D ASIP 2012
Oh yes, where was I before the holidays took over and hijacked my life for two weeks? I’ll bet you...
Temporary Bond/Debond: Not Ready for 3D TSV Prime TIme
It’s too bad SUSS MicroTec’s Wilfried Bair was one of the last presenters on Friday at 3D Architecures for Systems...
The Other 3D: IEDM 2012 Zeroes in on 3D Memory and 3D Transistors
Previews of IEDM 2012, which got underway today in San Francisco, indicate a program this year rich in content on...
