Unpacking AI’s Power-Hungry Demands
Dec 19, 2024 · By Jillian Carapella · 3D Event Coverage
Latest Posts - Page 11
Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium
I admit, I always have my 3D glasses on at conferences. But even though the title of this week’s MEPTEC...
Probing Questions at the IEEE 3D IC Test Workshop
As this year’s 3D IC Test Workshop unfolded (September 12 & 13, 2012), one thing became increasingly clear to me:...
3D Test Community Addresses Requirements for 3D Volume Production Testing
Don’t let the skeptics fool you, contrary to popular belief, the 3D test community has been hard at work on...
FormFactor Tackles Probe Test for 3D ICs
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long...
SSEC’s New Chemistry for TSV Reveal
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a...
How will the 450mm Transition Affect Advanced Packaging and 3D ICs?
That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual...
Alchimer Streamlines Wet Approach
Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development...
SETNA: Atmospheric Plasma Surface Modification
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known...
Dow Corning offers the Power of Silicone Technology
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview...
Interview with Fraunhofer IZM-ASSID’s Juergen Wolf: The Collaboration Grows
A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed...
EV Group: Never a Dull Moment
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with...
NORDSON: Newcomers to 3D ICs
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. As 3D ICs...
Interview with imec’s Ludo Deferm: Packaging Design Kits and Debond Solutions
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought...
Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization...
It Takes an Ecosystem to Launch 2.5D and 3D Integration
As 2.5D and 3D IC technologies round the ten-year development mark and volume manufacturing keeps getting pushed just beyond our...
And a Good Time was had by All – 3D InCites Awards Breakfast, 2013
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge...
2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on...
Sum of Minds – imec Makes the Unexpected Happen
In her opening remarks at the 2013 imec International Technology Forum (ITF), held Monday, July 8, 2013, Karen Savala, SEMI,...
Late Breaking SEMICON West News: Expert TechHUBs Added to this Year’s Agenda
New this year at SEMICON West, and just introduced to the program late last week, the Expert TechHUBs will help...
