Unpacking AI’s Power-Hungry Demands
Dec 19, 2024 · By Jillian Carapella · 3D Event Coverage
Latest Posts - Page 10
2.5D and 3D IC Technologies: Application Ready but Cost Limited?
Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and...
The 2014 European 3D TSV Summit: Get Ready for the Domino Effect
I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21...
TSVs for MEMS vs. TSVs for 3D ICS
The 2013 European 3D TSV Summit (January 20-22, Grenoble, France) kicked off with a pre-conference symposium on 3D TSVs for...
Wafer Level Packaging and Stacking take Center Stage at Asia Conferences
I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my...
Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
2.5D Interposer Innovations from Silex and eSilicon
2.5D interposers sparked a good amount of discussion at this year’s 3D ASIP conference (December 11-13, 2013, Burlingame CA), with...
3D ASIP 2013: Jan Vardaman’s 3D Readiness Report Card
While other presenters for the 2013 3D ASIP session, “Evolution of 3D Technologies and Market Trends” took a more conventional...
3D ASIP 2013: Coming Down The Home Stretch to 3D IC Commercialization
For years, we’ve been talking about the performance and power benefits of 2.5D and 3D ICs. We’ve also been talking...
Si Photonics: 3D ASIP’s Pre-game Show
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story...
3D TSV without Limits
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
GIT 2013: One Silicon Guy’s Perspective
A 3D conference (or 2.5D workshop) wouldn’t be a 3D conference (or 2.5D workshop) without someone announcing the push-out of...
Notes from GIT 2013
The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013....
Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVs
Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D...
Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013
The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
IWLPC 2013: Will the Changing Mobile World Usher in 3D ICs?
…For while the tired waves, vainly breaking, Seem here no painful inch to gain, Far back, through creeks and inlets...
IMAPS International 2013 3D Technology Highlights
Approximately 880 people registered for IMAPS International 2013, and yes the fiasco in Washington even affected IMAPS – there were...
3D ICs for High Performance Systems
A recent IEEC and IEEE CPMT workshop held on October 16, 2013 at Binghamton University in New York examined the...
A Breakfast of Cu Pillars, Wafer-level Packaging the Internet of Things, and more
I took a detour to work on Friday (Oct 18, 2013), stopping in at Freescale Semiconductor (Tempe AZ) to attend...
The Many Flavors of 3D DRAM
Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in...
