KOBUS

Based on FAST technology, KOBUS has developed a unique deposition solution to leverage the integration cost issue of TSV. With thick and conformal capabilities, our solution offers unique film properties at low temperature allowing for a drastic reduction in film thickness requirements, and thus can be extended to very high density and high aspect ratio features (> 20:1). There is a 25% reduction of integration cost, thereby dividing by two, the total Cu removal thickness before CMP. One tool answers both via middle and via last TSV integration requirements.  Relaxed via opening etch step results in conformal engineering along the TSV shape. Insensitivity to scalloping dimension variation.