Beth Keser

As IEEE Spectrum wrote in July 2016, Beth Keser is an established professional, an IEEE senior member, and a principal engineer in electronic packaging for Qualcomm Technologies. Dr. Keser's bio needs an update to include her role now at Intel as Director, Package Engineering, at Intel in Munich; Dr. Keser's accomplishments also include her significant contributions to fan-out packaging, both from the engineering side and from the education side, where she has so generously devoted her time and energy teaching seminars and short courses on the fundamentals of fan-out.