“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million”...
“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as...
Consumer demand for mobile phones weakened in 2018, resulting in a market decline. In this context, the competition has intensified,...
“Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established...
The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the...
Out of the top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China,...
Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation....
Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law...
Without a doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular...
The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt,...
“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter...
The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding...
“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and...
“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole)....
According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over...
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part...
Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts...
The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are...
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9%...
According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in...
