Nordson ELECTRONIC SOLUTIONS - MARCH Products

About MARCH, Nordson ELECTRONICS SOLUTIONS

MARCH Products, part of Nordson ELECTRONICS SOLUTIONS, has designed and manufactured plasma equipment for nearly 40 years.  Plasma removes impurities and activates surfaces to enhance flow and adhesion for improved package reliability during in semiconductor manufacturing. We are committed to developing next-generation solutions that address the need for automation, better uniformity, higher throughput, and effective plasma treatment of complex packaging structures.

Plasma can:

• Remove contamination before wafer bumping, organic contamination, fluorine and other halogen contamination, and metal and metal oxides.
• Descum wafer of residual photoresist and benzocyclobutene (BCB), pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer-applied mold/epoxy, strengthen the adhesion of gold solder bumps, de-stress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

Plasma treatment solutions for semiconductor manufacturing and advanced packaging:

• MARCH StratoSPHERE™ plasma system is ideal for wafer processing before typical back-end packaging steps, wafer fan out, wafer-level packaging, 3D packaging, flip-chip, and traditional packaging. The system processes up to 300 mm (12 in.) wafers and features a patented plasma chamber that delivers exceptional etch uniformity, process repeatability, cycle-time performance, and minimal cost of ownership. A three-axis symmetrical chamber ensures uniform treatment of all wafer areas and tight control over process parameters for highly repeatable results.
• MARCH FlexTRAK® plasma systems deliver superior quality and automation in one very configurable platform, resulting in high-throughput plasma processing and cleaning. FlexTRAK systems support manual and automated operations (with inline or built-in handler), SMEMA and SECS/GEM communication protocols, and remote user interface. Flexible chamber configurations support contamination removal, etching, and surface activation before die attach, wire bond, molding and encapsulation, and underfill applications.