Multibeam leads with a breakthrough multicolumn e-beam lithography solution for cost-effective production of leading-edge semiconductors and rapid time to market.
It is the industry’s only maskless multi-column e-beam platform that offers full-wafer direct write patterning capabilities with fine resolution in a modular architecture that is optimized for scale. The fully automated system features multiple miniaturized e-beam delivery columns and advanced algorithms that enable precision patterning with fab-level productivity.
For semiconductor leaders, it’s a new-generation lithography solution to enable advanced packaging, photonics, rapid prototyping, and other special applications that support megatrends like the growth of AI and demand for EVs.
Innovated by patterning and wafer fab equipment experts, our solution makes patterns that are impossible, difficult, or too expensive for mask-based solutions, with breakthrough time-to-market advantages.
Headquartered in Santa Clara, CA, Multibeam is led by Dr. David K. Lam, founder and former CEO of Lam Research Corporation.
