Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in...
Artificial Intelligence (AI) combines both hardware and software. TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found...
Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection,...
While Apple remains the main customer for TSMC’s Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a...
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip...
More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for...
Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its...
Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these...
A variety of alternatives is challenging silicon’s role in advanced packaging interposers for high-performance package applications. The first applications using...
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages...
Despite a slowing growth rate for smartphones, the industry is experiencing strong growth for CSP packages such as QFNs and...
With the proliferation of mobile electronic products and the ongoing push for greater functionality in a smaller area, miniaturization has...
Fan-out wafer level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry in...
Driven by use in mobile products such as smartphones, CSPs continue to show growth. TechSearch International’s latest CSP market forecast...
With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the...
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to...
