Shrinking silicon process nodes and increasing memory demands are a nightmare for PCB design teams working with custom ASICs or...
Moore’s law is increasingly difficult to maintain and is driving the growth of innovative, high-density advanced packaging technologies in response...
The challenge of designing smaller, cost-effective systems that require additional processing and performance power led to 3D chip stacking of...
As next-generation High-Density-Advanced-Packaging (HDAP) designs become more common, PCB designers and engineers are looking to system-level co-design to tie multi-substrate...
While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity...
Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by...
Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in...
Traditionally, MCMs (Multi-Chip-Modules) were a way of integrating several ASICs, or ASICs and memory, into a lower-cost, smaller form-factor, robust...
Today’s SoCs, multi-core CPUs and GPUs with their high performance, high bandwidth interconnect interfaces put demanding challenges across the entire...
Packages and boards are playing an increasing role as a way to increase speed and density while reducing power and...
Three-dimensional Integrated circuits (3DIC) are generating increased interest as a way to increase speed and density while reducing power and...
Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is...
Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve...
