Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s...
Siemens Digital Industries Software is bringing an innovative approach to sharing accurate thermal models of integrated circuit (IC) packages to...
Numerous package designers possess extensive hands-on experience in crafting organic FR4/HDI build-up BGA/LGA substrates. They have mastered the design guidelines,...
Siemens Digital Industries Software today announced that Stanley Electric (“Stanley”), a leading automotive electronics company, has adopted Siemens’ Questa™ Advanced...
Research collaboration to bring greater use of artificial intelligence and cloud computation in the world’s most comprehensive digital twin across...
Siemens Digital Industries Software today announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of...
Siemens has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) – (Image courtesy...
Siemens Digital Industries Software today announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic...
Acquisition will extend Siemens’ enterprise verification platform, adding Avery‘s Verification Protocol and Compliance Test Suite offerings Customers can optimize quality...
Siemens’ Capital™ Electra™ X is a new cloud-native electrical design software aimed at individual electrical designers or small teams that...
Siemens Digital Industries Software today announced that Samsung Foundry has certified Siemens‘ Aprisa™ solution for the foundry’s advanced 4nm FinFET...
Siemens’ Tessent Multi-die software helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based...
To satisfy industry demand for continued increases in electronic functions per unit area, foundries and outsourced assembly and test (OSAT)...
With the economics of transistor scaling no longer universally applicable, the semiconductor industry faces an inflection point as higher cost,...
With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support...
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon...
Siemens Digital Industries Software today announced it has become a charter member of the Intel Foundry Services (IFS) Accelerator –...
Siemens Digital Industries Software today announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs)...
In this paper, we review the three methodologies commonly used to achieve foundry/OSAT requirements for metal-filled areas and planes in...
Moore’s law is increasingly difficult to maintain. With the economics of transistor scaling no longer universally applicable, the industry is...
