Koh Young Europe

About Koh Young Europe

Established in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry.

Semiconductors have driven advances in communications, computing, health care, military systems, transportation, clean energy, and countless other applications. And they are giving rise to new technologies that hold the promise to transform society for the better, including brain-inspired computing, virtual reality, the Internet of Things, energy-efficient sensing, automated devices, robotics, and artificial intelligence. Semiconductors’ greatest potential lies ahead.

As advanced packaging continues evolving, device thickness is paramount since consumers demand smaller products with more functionality. Therefore, the company has released the MEISTER product family, a portfolio of True 3D^TM Inspection Solutions for solder paste, printed bumps, and solder ball as well as small components like 0201Ms and highly reflective die. With those solutions, it is possible to inspect SiP, FCBGA, FOWLP/FOPLP and WLCSP packages with high UPH (Unit per Hour).

The Meister D is a perfect solution for production-speed 3D inspection for component and die inspection solution targeting die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chipping, foreign material, and more.

The Meister D+ combines industry leading Moiré technology and Koh Young’s proprietary new optics to support 3D inspection of highly reflective dies (mirror surface), a long-term inspection challenge.

The Meister S has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder inspection with superior full 3D inspection performance. Combining innovative vision algorithms and high-resolution optics, the Meister S goes beyond micro solder paste inspection, but also a proven solution for Flux inspection.

The Meister for Wafer-Level Packaging with multiple resolutions and configurable options meets the needs of WLP applications such as micro solder on wafer, shiny components and highly reflective components on substrates.

The company´s activities stem from the corporate headquarters in Korea to its sales and support offices in Germany, Japan, Singapore, Vietnam, Malaysia, China, Brazil, Argentina, Canada, Mexico, and the United States. These local facilities ensure it keeps in close contact with the market, and more importantly, its growing customer base to provide access to an award-winning network of inspection and measurement experts. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at kohyoung.com.