Today KLA Corporation introduced the industry’s widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing. KLA’s...
The Orbotech Corus™ DI platform provides a fully automated and extendable solution for highly accurate and efficient patterning processes MILPITAS,...
MILPITAS, Calif., Sept. 29, 2022 /PRNewswire/ — KLA Corporation (NASDAQ: KLAC) has announced plans to build a new research-and-development (R&D)...
MILPITAS, Calif., Nov. 5, 2021/PRNewswire—KLA Corporation (NASDAQ: KLAC) today announced the official opening of its second U.S. headquarters, a $200 million facility in...
A Technology Chasm Until recently, the world of IC fabrication was neatly divided into the distinct stages of front-end and...
PWG5™ attacks 3D NAND process issues while Surfscan® SP7XP tackles 3nm logic defectivity Today KLA Corporation (NASDAQ: KLAC) announced two new...
New Tools Drive Innovation in Semiconductor Packaging with AI Solutions that Improve Yield and Quality MILPITAS, Calif., Sept. 21, 2020...
New Business Group Targets Growth Opportunities in Fast-Growing Sectors KLA Corporation (NASDAQ: KLAC) today announced the formation of a new...
MILPITAS, Calif., Feb. 20, 2019—KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). “We...
MILPITAS, Calif., July 10, 2018—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in...
KLA-Tencor Corp. has been recognized as one of 26 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their...
KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for...