SAN JOSE, Calif.—July 10, 2024—Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for...
Adeia Inc., a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the semiconductor and...
The rapid rise of new artificial intelligence (AI) applications — boosted recently by broad interest in generative AI (GenAI) —...
San Jose, Calif.– January 4, 2024 – Adeia Inc. (Nasdaq: ADEA) today announced that Joseph Guiliano was appointed as Adeia’s...
SAN JOSE, Calif.—Nov. 1, 2023— Adeia Inc. (Nasdaq: ADEA) has been recognized on Newsweek’s inaugural list of the World’s Most...
Agreement includes a license to Adeia’s Hybrid Bonding Portfolio SAN JOSE, Calif., March 28, 2023 — Adeia Inc. (Nasdaq: ADEA)...
Agreement includes a license to Adeia’s Hybrid Bonding Portfolio SAN JOSE, Calif., March 28, 2023 — Adeia Inc. (Nasdaq: ADEA)...
SAN JOSE, Calif., Feb. 15, 2023 (GLOBE NEWSWIRE) — Adeia Inc. (Nasdaq: ADEA) (“Adeia” or the “Company”), the company whose...
Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging KISSIMMEE, Fla....
Technology transfer includes DBI® Ultra die-to-wafer hybrid bonding know-how SAN JOSE, Calif. & YOKOHAMA, Japan, May 04, 2022–(BUSINESS WIRE)–Adeia, the newly...
Xperi’s IP Licensing Business Deepens its Presence in Memory Market SAN JOSE, Calif.–(BUSINESS WIRE)–Adeia, the newly launched brand for the...
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to YMTC for its 3D NAND memory products SAN JOSE, Calif. –Xperi...
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to Canon to enhance image sensors in its industry-leading products SAN JOSE,...
Invensas direct and hybrid bonding technologies licensed by Tower Semiconductor to further enhance its outstanding pixel performance and significant competitive...
SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading...
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry...
The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This...
Consumer electronics designers continue to demand thinner and lighter packages while devices increase in functional complexity. The Fan-Out Wafer Level...
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., (Nasdaq: TSRA) has announced that Fraunhofer EMFT has signed a...
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a...