IBM offers chiplet and advanced packaging technology capabilities to supercharge innovations for AI and logic. By bringing multiple technologies together at the package level to increase performance and reduce cost, our frameworks provide a new paradigm for semiconductor innovations as well as a new pathway to meet AI’s increasing performance demands. Our packaging facility in Bromont, Canada is the largest Outsourced Semiconductor Assembly and Test facility in North America. From development to high volume manufacturing, the team at Bromont are driven by their mission to transform semiconductor components into state-of-the-art microelectronic solutions.
New co-packaged optics innovation could replace electrical interconnects in data centers to offer significant improvements in speed and energy efficiency...
