Henkel and Teca-Print today have announced a partnership in the pad printing field of printed electronics. The collaboration aims to...
Semiconductors are the micro-sized “brains” that power modern electronics, and the latest advancements in semiconductor packaging materials are transforming key...
Irvine, CA – Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements...
Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers...
Irvine, CA – Henkel today announced the addition of Loctite Ablestik ABP 8068TI to its growing portfolio of high thermal...
Irvine, CA – As integrated circuits (ICs) become more dense and complex, particularly in the power device sector, new approaches...
Henkel semiconductor packaging innovations earn Material Supplier of the Year Award Irvine, CA – Henkel today announced that it has...
Irvine, CA – Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications....
Irvine, CA – Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the...
This paper is co-authored by two of our member companies, Henkel Corporation and LPKF Laser & Electronics AG Laser Direct...
Highly-filled, fast-flow material balances reliability and processability, extends company’s package-level underfill leadership with multi-format solutions SEOUL, South Korea, Sept. 14,...
Investment to drive localized innovation and to strengthen collaboration with consumer electronics customers. Henkel has officially opened its South China...
Irvine, CA – Henkel today announced the opening of its Application Center in Santa Clara, CA designed to support product...
NCP and NCF Property Optimization Delivers High-Reliability Results Semiconductor package sizes are getting smaller and bump pitches narrower while the...
While critical to the processes, molding and encapsulation materials used in both fan-in and fan-out wafer-level packages (FI WLP/FO WLP) ...