From basic webinars and Zoom happy hours (like our SemiSister Social Hour above), to full-blown technical conferences, trade shows, and...
San Jose, California – USA – The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of...
A headline on CNN Business caught my eye last night: Working mothers are quitting to take care of their kids,...
I first met Dr. Thomas Fries, Founder, and CEO of FRT, The Art of Metrology in 2016 at SEMI Europe’s...
This morning at Virtual SEMICON West, I tried to attend a bunch of sessions and take notes so I could...
I had a dream last night that the SEMI team was a little upset with me because we were getting...
Whew! That was a busy two hours! Here’s a short blog post about my initial impressions of Virtual SEMICON West...
This feels weird, folks. For the first time in 15 years, I didn’t board a flight bound for SEMICON West...
Over the past few years, we’ve seen KLA evolving from its origins as a process control company focused on front-end...
If you’ve attended the IMAPS Device Packaging Conference over the past three years, you probably noticed a hand-drawn mural coming...
Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this...
50 years of providing specialized thermal solutions to the semiconductor industry is a significant accomplishment. It means your company is...
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately,...
One silver lining to COVID 19 for the microelectronics and advanced packaging communities is the ability to attend virtual ECTC...
Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer...
A live webinar on Recovery and Growth Areas After COVID-19 kicks off virtual programming May 20th. [May 15, 2020 –...
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first...
Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites...
At last month’s IMAPS Device Packaging Conference, when I was not in keynote sessions, I was spending time chatting with...
Developing an industry standard is no easy task, and for those involved, its acceptance and publication is something to be...
