Françoise in 3D

Getting the picture in 3D

Jun 11, 2009 · By Francoise von Trapp · Francoise in 3D

When you’re totally immersed in any one topic, and therefore listen to nothing but presentations about novel processes, solutions, progress,...

Can you hear me thinking?

Jun 10, 2009 · By Francoise von Trapp · Blogs

I wasn’t surprised at how loud my thoughts could be. After all, I have to listen to my own mind...

TSVs: just the tip of the 3D ICeberg

Jun 06, 2009 · By Francoise von Trapp · Francoise in 3D

At ECTC last week, I counted at least 21 presentations dedicated to TSVs alone, and 13 dedicated to other processes...

NEXX Systems: Going Strong in Tough Times

Jun 03, 2009 · By Francoise von Trapp · Blogs

View slide show of my visit...

TGIF 3D Buzz #2

Jun 02, 2009 · By Francoise von Trapp · Blogs

A German friend of mine suggested I might want to keep my European readers in mind when I use typically...

Can cost-sharing accelerate 3D IC commercialization?

May 18, 2009 · By Francoise von Trapp · Blogs

I’ve been talking a lot about the collaborative efforts in the form of open and closed consortia and joint development...

News from IMEC’s technology forum

May 06, 2009 · By Francoise von Trapp · Blogs

From the looks of my inbox, it’s been a busy week at IMEC, between the 25th anniversary celebration and technology...

May Events in 3D

May 05, 2009 · By Francoise von Trapp · Blogs

I wish I could be everywhere at once, because there are so many events involving 3D coming up well worth...

GBC 2009 – A 3D Packaging Junkie’s Dream

May 02, 2009 · By Francoise von Trapp · Blogs

When I opened Lee Smith’s email yesterday to find the updated agenda for Spring 2009 IMAPS Global Business Council,...

The post-fab process debate for 3D ICs: foundry or OSATS

Apr 29, 2009 · By Francoise von Trapp · Blogs

Inquiring minds want to know: who is going step forward and claim ownership of post-fab processes for 3D IC stacking...

SPP/SPTS ships 300mm DRIE tool to CEA-LETI

Apr 12, 2009 · By Francoise von Trapp · Press Releases

SPP Process Technology Systems (SPTS) and its parent company

Old World to New World in under 5 minutes

Apr 10, 2009 · By Francoise von Trapp · Blogs

I just got back from a stroll from the Begijnhof Congres Hotel to the Grote Markt (Great Market Square)...

Live, from Dobson Ranch, it’s MEPTEC’s Southwest Luncheon

Apr 09, 2009 · By Francoise von Trapp · Blogs

While I’m clearly a huge believer of leveraging the Internet for interactive communication (heck, 3D InCItes was founded on that)...

IWLPC to Feature Five Half-Day Tutorials

Apr 08, 2009 · By Francoise von Trapp · Press Releases

The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level...

6th Annual IWLPC Program Set

Apr 08, 2009 · By Francoise von Trapp · Press Releases

The SMTA, in conjunction with Chip Scale Review magazine, is pleased to announce the program for our 6th Annual...

3D from all angles at DATE 2009 3D workshop

Apr 05, 2009 · By Francoise von Trapp · Blogs

As I was unable to attend Design Automation Test in Europe (DATE 2009) myself, but felt the information being shared...

ALLVIA – A TSV Success Story

Apr 02, 2009 · By Francoise von Trapp · Blogs

Is ALLVIA ahead of the pack? While the rest of us wonder when through silicon via (TSV) will be ready...

Alchimer: A Growing Concept

Mar 11, 2009 · By Francoise von Trapp · Blogs

In an understated research lab and recently upgraded demo facility located just outside Paris in Massy, France, Alchimer scientists...

IWLPC 2009 speakers put 3D up front

Mar 11, 2009 · By Francoise von Trapp · 3D Event Coverage

Sure, 3D integration and packaging isn’t the only game in the semiconductor industry town, but even at events like last...

A funny thing happened on the way to IMAPS 2009