Francoise News - Page 56
Other 3Ds: The many uses for LCP
Last fall before SEMICON Europa, Andreas Ostmann, manager of the embedding and substrate technologies group, Fraunhofer IZM, spent some time...Discussion Summary: Overcoming weaknesses in dry processes for TSV metallization
This week’s online forum with Alchimer’s executive team, Steve Lerner, CEO; Kathy Cook, Director...Terepac begins pilot production of printed silicon ICs
Terepac Corporation has begun shipping samples of its ultrathin, flexible, silicon-based products to selected customers from its plant in Waterloo,...Taking the “pick” out of pick-and-place
Up until now, although it was possible to manufacture miniscule (e.g. 175µm square) RFID and wireless sensor chips using advanced...Pre-conference symposium reviews 3D integration
It’s always a challenge to adequately sum up several hours of detailed discussion on a topic, and this afternoon’s symposium...The TSV wave hits Asian shores
A wise industry executive once told me (ok, it was Wilfried Bair, of SUSS MicroTec) that we would know when...Is the industry ready for 3D ICs?
My favorite people to talk to in the 3D space are those who work in R&D. There is an energy...Alchimer Introduces AquiVia Deposition Process
Alchimer S.A. announced that its AquiVia deposition process is ready for implementation. AquiVia process can reportedly reduce overall cost...
A final (?) word on filling TSVs
Now look what I’ve started. After posting Bob Patti’s solution for performing UBM with conformal TSVs, I got a phone...EVG’s partnership with Léti adds a third dimension
As the old saying goes, things usually happen in threes… and in this case 3D. Three years ago, EV Group...Collaborate, innovate, and get ready for the rebound
I know where many of the optimistic people in the semiconductor industry were today; giving presentations at the Global Business...Breaking News from Global Business Council
I promised that as soon as I knew who NEXX’s new collaboration was with, I would let you all know....The Other 3D Packaging Technologies
While TSV developments continue to attract media attention as the rock star technology of 3D integration, it’s important to remember...Bringing Transparency to 3D Integrated Structures – Olympus Confocal IR Microscopy
Metrology is consistently one of the more challenging areas in the semiconductor field. Whether it’s the monitoring of ultra-small...
Was Moore’s Law really meant to be a law or more of a guideline?
Before I joined the semiconductor industry, I was completely unaware of this guy Gordon Moore, whose observations and predictions set...Georgia Tech’s Rao Tummala to deliver IWLPC Dinner Keynote
Trend and Progress from ICs to 3D ICs to 3D Systems-on-Wafer
This year's IWLPC dinner keynote address...
IMAPS Global Business Council Announces Fall Progam
Titled "Recovery of the Semiconductor Market.", IMAPS GBC will feature two guest speakers. Andrea Lati, market research analyst for...
A*STAR and EDB launch 3D TSV consortium in Singapore
The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), launched a...
