Francoise News - Page 56
From the DPC: Panelists address burning questions for 3D IC integration
I’m glad I stuck around last evening for the 3D panel discussion on the status of 3D integration technologies, applications...3D Architectures: Day One Talking Points
They brought in a few of the big guns today (Intel, IBM, TSMC) to offer perspectives and updates on the...Filled vs. conformal vias: the consensus
Dr. Zhang, I think we have reached a verdict.Bob Patti wrote in to confirm Anonymous Caller’s statement...
Sound Bites from IMAPS Global Business Council
Yesterday, a full line up of industry experts offered their perspective of supply chain developments for 3D packaging, in addition...Other 3Ds: The many uses for LCP
Last fall before SEMICON Europa, Andreas Ostmann, manager of the embedding and substrate technologies group, Fraunhofer IZM, spent some time...Discussion Summary: Overcoming weaknesses in dry processes for TSV metallization
This week’s online forum with Alchimer’s executive team, Steve Lerner, CEO; Kathy Cook, Director...Terepac begins pilot production of printed silicon ICs
Terepac Corporation has begun shipping samples of its ultrathin, flexible, silicon-based products to selected customers from its plant in Waterloo,...Taking the “pick” out of pick-and-place
Up until now, although it was possible to manufacture miniscule (e.g. 175µm square) RFID and wireless sensor chips using advanced...Pre-conference symposium reviews 3D integration
It’s always a challenge to adequately sum up several hours of detailed discussion on a topic, and this afternoon’s symposium...The TSV wave hits Asian shores
A wise industry executive once told me (ok, it was Wilfried Bair, of SUSS MicroTec) that we would know when...Is the industry ready for 3D ICs?
My favorite people to talk to in the 3D space are those who work in R&D. There is an energy...Alchimer Introduces AquiVia Deposition Process
Alchimer S.A. announced that its AquiVia deposition process is ready for implementation. AquiVia process can reportedly reduce overall cost...
