Francoise News - Page 52
EV Group Capitalizes MEMS Market Leadership, Further Diversifies Business with 3D IC and LED Manufacturing Technology Advances
Company to share key developments and highlights at SEMICON West
Do You Tweet?
Is the semiconductor industry ready for social media? Based on MCA’s Social Media Panel discussion on Monday evening, maybe...
SEMI International Standards Program Forms 3D Stacked IC Standards Committee
SEMI announced today the formation of a Three-Dimensional Stacked Integrated Circuits (3DS-IC) Standards Committee. 3DS-ICs are composed of a stack...TSVs: Emerging No Longer
What makes something an emerging technology, and what makes it near-term? I asked this question of the IEDM technical committee...austriamicrosystems Introduces “More Than Silicon” Initiative
austriamicrosystems Full Service Foundry business unit today introduced its “More Than Silicon” initiative, a comprehensive service and technology package that...Queen of 3D meets King of Flip Chip
It’s not often that I get to meet other members of the semiconductor aristocracy, so I was delighted to recently...Dr. Bill Bottoms joins Alchimer Board
Alchimer S.A., provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias, announced...IITC Technical Conference Expands Program to include 3D Memory
A new industry emphasis on 3D memory technology has prompted the 2010 IEEE International Interconnect Technology Conference (IITC) to expand...eWLB Manufacturer selects SPTS as a partner for their 300mm Roadmap
Semiconductor equipment manfacturer, SPP Process Technology Systems (SPTS) announced that it has shipped aAnother Link in Leti’s Design Flow Chain
Leti’s recent press release about the common lab agreement between CEA Leti and Docea Power inspired another...Elpida, PTI, and UMC Partner on 3D IC Integration Development
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corporation (UMC), have entered into a 3-way cooperation to advance...CMP/CMC/MOSIS partner to introduce a 3D-IC process
CMP/CMC/MOSIS announced a Grenoble-France based partnership for a 3D-IC multi-project wafer (MPW) service based on Tezzaron’s SuperContact technology and...
Alchimer Introduces Via Fill Technology
Alchimer S.A. has announced a groundbreaking advanced technology for filling narrow, high-aspect-ratio TSVs while significantly reducing...Boooooo to the Naysayers
Ok, I’m annoyed. I just read an article (thanks for pointing me to it Gretchen Patti) that appeared last week...Strategic Restructuring of the SUSS MicroTec Group
SUSS MicroTec has announced its decision to relocate its Substrate Bonder division...ECTC 2010 Panel Examines the Medical Device Market
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond...EDA Vendors; Ramped and Ready for 3D
Due to extenuating circumstances, (Ok, truth: I’d just returned from a much needed 2 week vacation) I was unable to...CEA-Leti and Docea Power to Combine Expertise on 3D Integration, Thermal and Low-power Design
French research insitute, CEA-Leti and Docea Power, developers of software for power and thermal analysis at the architectural level,...
