Every once in a while, it’s helpful to step back and get a broad view of what’s going on in...
Alchimer announced the opening of a new applications-and-development facility in Seoul, South Korea, for...
SUSS MicroTec has appointed Dr Rainer Knippelmeyer as VP R&D and CTO. In this function Rainer Knippelmeyer will oversee research...
You know how sometimes you feel like you know a person you haven’t actually met because you read something they...
In an ongoing effort to drive 3D IC integration, SEMATECH’s 3D Interconnect program has completed its 300mm 3D IC pilot...
A critical challenge for fabricating 3D products is the integration of the dies with through-silicon vias (TSVs) into functioning and...
My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf,...
SEMATECH, the Semiconductor Industry Association (SIA), and Semiconductor Research Corporation (SRC) announced today they have established a new 3D Enablement...
Today’s side trip to the GSA’s 3D EDA Interest Group’s bimonthly meeting (sandwiched between IEDM 2011 and RTI’s 3D Systems...
SPP Process Technology Systems (SPTS) announced the opening of its new facility in San Jose, CA, serving as the home...
I have to say that this was THE quote of last week, uttered by MEMS Industry Group’s managing director, Karen...
Sometimes I like to mix it up a bit. So last night I was the invited guest speaker at the...
Oh…..and a bus. It takes one of each to get to Newport, South Wales from Munich.
For me, SEMICON West is never complete until I’ve had my sit-down with
Manish... 
Note to self: when visiting a class 10 clean room that requires full...
Is it mere co-incidence that companies who have invested in 3D technologies seem to have escaped the effects of the...
While TSVs technologies make their way out of R&D on to the manufacturing floor, improvements and developments in non-TSV 3D...
Time for a little reflection… can we say that there was an air of optimism at SEMICON West this year?...
Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSV), semiconductor interconnects, and...
