When a research institute is evaluating different options for technology partnerships, what tips the scales in favor of one supplier...
Imec Taiwan has signed the co-funding contract with the Taiwanese Ministry of Economic Affairs (MOEA) for its R&D activity Imec...
New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance SEMICON EUROPA, Dresden, Germany, October 19,...
Ever since I interviewed Jürgen Wolf, manager of Fraunhofer IZM All Silicon System Integration Dresden (ASSID) about the Dresden-based institute’s...
Order from Sensonor Enables EVG to Leverage Decades-long Expertise in Wafer Bonding to Support Emerging, High-growth MEMS Market SEMICON EUROPA,...
I caught up with Alchimer CEO, Steve Lerner last week at the IWLPC in Santa Clara, to find out how...
So I’m sitting here back at my desk, sifting through my pile of notes from this week’s adventures at the...
One of the main themes of last week’s MEMS Executive Congress was to “think outside the chip” (Roger Grace, of...
Designing and building a prototype MEMS device with TSVs in it is pretty much unheard of. As Alissa Fitzgerald, Ph.D.,...
Ok, maybe I should say Gartner’s crystal ball, but whenever Jim Walker delivers a presentation based on Gartner research, he...
In developing an application to integrate 128 processors on a single chip, ST Microelectronics turned to Leti for assistance. To...
As human beings, we take a lot of things for granted; breathing, for example, or our heart beating when it...
EVG System Enables Void-free Wafer Bonding of III-V Compound Semiconductor Materials on Silicon Wafers with High-quality Surface Preparation TOKYO, JAPAN,...
This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when...
Every once in a while it helps to step back and take a look at the big picture. For me,...
Top university selects EVG systems on strength of flexible technology, local service and support ST. FLORIAN, Austria, September 23, 2010...
Guest contributor, Herb Reiter, reports from the Sept 13 meeting of the GSA’s 3D/TSV EDA Interest Group, where 55 attendees,...
I love field trips. This week, I took one over to historic old town Chandler, AZ, where IMAPS Arizona chapter...
The official inauguration of STATS ChipPAC’s 300mm eWLB facility was held September 15, at the company's Yishun facility in Singapore...
It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner...
