Françoise in 3D

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R&D Round-up Part 2: CEA-Leti rolls out TSV and Non-TSV Demonstrators

Nov 01, 2010 · By Francoise von Trapp · 3D Event Coverage

Reporting progress for CEA-Léti was 3D program manager Mark...

3D R&D Round-up: Part 1: RTI International

Nov 01, 2010 · By Francoise von Trapp · 3D Event Coverage

At last month’s 3D Architectures for Semiconductor Integration and Packaging Conference, coordinated by RTI International, three government-funded research institutes...

Atrenta and CEA-Leti Sign a Multi-Year Collaboration Agreement

Oct 28, 2010 · By Francoise von Trapp · 3D In-Depth

Atrenta Inc., provider of Early Design Closure® solutions that improve design efficiency throughout the IC design flow, has signed a...

A Neophyte in Tokyo

Oct 24, 2010 · By Francoise von Trapp · Blogs

Just arrived in Tokyo – my first visit to Asia ever. I’m here at the invitation of Paul Werbaneth, of...

3-D chips and Evolving Test Strategies Take Center Stage at ITC

Oct 21, 2010 · By Francoise von Trapp · 3D Event Coverage

Program chair Erik Volkerink of Verigy discusses this year's International Test Conference in an interview with Rick Nelson, Chief Editor,...

An In-Depth Look at Leti’s Common Lab with SPTS

Oct 21, 2010 · By Francoise von Trapp · 3D Event Coverage

When a research institute is evaluating different options for technology partnerships, what tips the scales in favor of one supplier...

Imec sets up R&D activity in Taiwan

Oct 20, 2010 · By Francoise von Trapp · 3D In-Depth

Imec Taiwan has signed the co-funding contract with the Taiwanese Ministry of Economic Affairs (MOEA) for its R&D activity Imec...

EVG Unveils EVG520L3 Next-Generation Wafer Bonding System with Key Cost-of-Ownership Advantages for Advanced Packaging and MEMS

Oct 19, 2010 · By Francoise von Trapp · 3D In-Depth

New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance SEMICON EUROPA, Dresden, Germany, October 19,...

Munich’s Fraunhofer Institute Comes Full Circle

Oct 19, 2010 · By Francoise von Trapp · 3D In-Depth

Ever since I interviewed Jürgen Wolf, manager of Fraunhofer IZM All Silicon System Integration Dresden (ASSID) about the Dresden-based institute’s...

EV Groups’s Gemini Wafer Bonder Selected by MEMS Pioneer Sensonor for High-Volume Production of Thermal Imaging Devices

Oct 18, 2010 · By Francoise von Trapp · 3D In-Depth

Order from Sensonor Enables EVG to Leverage Decades-long Expertise in Wafer Bonding to Support Emerging, High-growth MEMS Market SEMICON EUROPA,...

Alchimer in Asia: Things are Cooking

Oct 18, 2010 · By Francoise von Trapp · 3D In-Depth

I caught up with Alchimer CEO, Steve Lerner last week at the IWLPC in Santa Clara, to find out how...

Is the Bloom off the 3D TSV Rose?

Oct 15, 2010 · By Francoise von Trapp · Blogs

So I’m sitting here back at my desk, sifting through my pile of notes from this week’s adventures at the...

Simulation and Modeling Tools enable 3D MEMS Systems

Oct 11, 2010 · By Francoise von Trapp · 3D In-Depth

One of the main themes of last week’s MEMS Executive Congress was to “think outside the chip” (Roger Grace, of...

TSVs Find Their Way into Prototypes

Oct 11, 2010 · By Francoise von Trapp · 3D In-Depth

Designing and building a prototype MEMS device with TSVs in it is pretty much unheard of. As Alissa Fitzgerald, Ph.D.,...

Jim Walker’s Crystal Ball

Oct 09, 2010 · By Francoise von Trapp · Blogs

Ok, maybe I should say Gartner’s crystal ball, but whenever Jim Walker delivers a presentation based on Gartner research, he...

European PRO3D Consortium Takes on the Memory Wall

Oct 05, 2010 · By Francoise von Trapp · 3D In-Depth

In developing an application to integrate 128 processors on a single chip, ST Microelectronics turned to Leti for assistance. To...

Building the 3D Central Nervous System

Oct 05, 2010 · By Francoise von Trapp · Blogs

As human beings, we take a lot of things for granted; breathing, for example, or our heart beating when it...

EV Group Installs its Wafer Cleaning System for Compound Semiconductor Research at the University of Tokyo

Sep 29, 2010 · By Francoise von Trapp · 3D In-Depth

EVG System Enables Void-free Wafer Bonding of III-V Compound Semiconductor Materials on Silicon Wafers with High-quality Surface Preparation TOKYO, JAPAN,...

Progress is Progress in the Medical Device World

Sep 27, 2010 · By Francoise von Trapp · 3D In-Depth

This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when...

Going the Distance in Medical Electronics

Sep 24, 2010 · By Francoise von Trapp · Blogs

Every once in a while it helps to step back and take a look at the big picture. For me,...

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