SPP Process Technology Systems (SPTS) has shipped an APS etch system to Fraunhofer ISIT (FhG-ISIT). The system will add new...
Alchimer, provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects, MEMS and other electronic applications, announced that the...
CEA-Leti has announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are...
Its official – having a cell phone has become more important to people than wearing shoes. You think I’m kidding?...
Things have been pretty crazy lately, what with wearing several hats and all. I spent two days in Silicon Valley...
This column by Francoise von Trapp appeared in the Jan/Feb 2011 issue of Chip Scale Review It sums up a...
Ziptronix Inc., the leading developer of direct bonding technology for advanced semiconductor applications, announced today that recent collaborations with major...
Ziptronix, Inc. has signed a licensing agreement with Sony Corporation for the use of Ziptronix’s patents regarding oxide bonding technology...
As dedicated as I am to the 3D integration cause, there’s not much that will get me out of...
When it comes to 3D chip stacking, chip-to-wafer (C2W) processes have proven to be the way to go for stacking...
CEA-Leti and its partners have developed a system combining motion-capture and precise indoor localization. The goal of this device is...
Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration,...
In a move that promises to provide increased performance and smaller size for portable electronics and other advanced systems, CEA-Leti...
Rudolph Technologies, Inc., provider of process characterization equipment and software for wafer fabs and advanced packaging facilities announced that it...
Grenoble-based research institute, CEA-Leti, will significantly expand its technology offering this month when it ramps up one of Europe’s first...
It looks like it’s all starting to come together. 2010 closed out with promising news for 3D ICs and TSV...
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. , announced today that it has acquired the patent assets...
ST. FLORIAN, Austria, June 1, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for...
Symbolism and analogies were flying fast and furious yesterday at the GSA Memory Conference in San Jose, CA. which addressed...
Last week, I was reading a press release on iSuppli's website titled, And Then There Were Three: Ranks of Leading-Edge...
