Francoise News - Page 48
CEA-Leti Ramps up 300mm Line Dedicated to 3D-Integration Applications
Grenoble-based research institute, CEA-Leti, will significantly expand its technology offering this month when it ramps up one of Europe’s first...2011: Closing in on 3D Commercialization
It looks like it’s all starting to come together. 2010 closed out with promising news for 3D ICs and TSV...Invensas Acquires ALLVIA 3D-IC Packaging Technology
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. , announced today that it has acquired the patent assets...EV Group Teams with Industrial Technology Research Institute (ITRI) on Advanced MEMS Research and Development
ST. FLORIAN, Austria, June 1, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for...Elephants, Bunnies, and Sandwiches: A Few Favorite Things from the GSA Memory Conference
Symbolism and analogies were flying fast and furious yesterday at the GSA Memory Conference in San Jose, CA. which addressed...Will 3D Integration Keep 2nd Tier Foundries Alive?
Last week, I was reading a press release on iSuppli's website titled, And Then There Were Three: Ranks of Leading-Edge...Our Baby’s All Grown Up!
I just read Mark LePedus’ (EE Times) coverage of the 3-D Architectures for Semiconductor Integration and Packaging last week in...Alchimer and Nagase & Co Sign Exclusive Agreement
Alchimer S.A, provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, is extending its...EV Group Introduces Industry’s First Fully Automated Wafer Bonding System for HB-LED Manufacturing
EVG560HBL Significantly Increases Throughput for Volume HB-LED Production