SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
Applied Materials, Inc. announced its new Applied Producer®OptivaTM CVD system that enables the manufacture of state-of-the-art, backside-illuminated (BSI) image sensors used...
Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling,...
Last week’s announcement of Alchimer’s expansion into Taiwan via its Representative agreement with Kromax International Corp. further exemplifies the company’s...
SEMATECH announced that Advanced Semiconductor Engineering (ASE) Incorporated, Altera Corporation, Analog Devices Inc. (ADI), LSI Corporation, ON Semiconductor Corporation, and...
St. Florian, Austria, April 19, 2011 – EV Group (EVG) today announced that its longtime customer and partner, industry-leading research...
STATS ChipPAC Ltd, and outsourced semiconductor assembly and test (OSAT) provider, announced it is expanding its 300mm through silicon via...
Will the path to 3D integration be evolutionary or revolutionary? Will 2.D interposer technology be the only route or is...
In this article that appeared in the April Issue of CSR Tech Monthly, Andrew Smith, Ron Csermak, and Mark Vandermeulen ...
Coverage of the GSA Memory Conference continues in this week's issue of Chip Scale Review Tech Monthly. Francoise von Trapp...
Once again, I can’t let my follow-up coverage of SEMICON West go by without reporting on my annual briefing with...
As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields...
CEA-Leti and IPDiA have formed a common lab to capitalize on their complementary expertise in miniaturization and 3D integration on...
I have to admit, after the first day of IMAPS Device Packaging Conference last week, I was thinking, “Well, that...
There’s nothing like a natural disaster to remind us of how delicate the balance is between life and death, and...
Earlier this week Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced both its acquisition of ALLVIA’s patent assets,...
Rudolph Technologies, Inc., provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that...
I got an email last week from R. Colin Johnson, of EE Times, looking for my impression on the collaboration...
SPP Process Technology Systems (SPTS), manufacturer of plasma etch, deposition, and thermal processing equipment for the semiconductor industry today has...
