CEA-Leti and IPDiA have formed a common lab to capitalize on their complementary expertise in miniaturization and 3D integration on...
I have to admit, after the first day of IMAPS Device Packaging Conference last week, I was thinking, “Well, that...
There’s nothing like a natural disaster to remind us of how delicate the balance is between life and death, and...
Earlier this week Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced both its acquisition of ALLVIA’s patent assets,...
Rudolph Technologies, Inc., provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that...
I got an email last week from R. Colin Johnson, of EE Times, looking for my impression on the collaboration...
SPP Process Technology Systems (SPTS), manufacturer of plasma etch, deposition, and thermal processing equipment for the semiconductor industry today has...
SPP Process Technology Systems (SPTS) has shipped an APS etch system to Fraunhofer ISIT (FhG-ISIT). The system will add new...
Alchimer, provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects, MEMS and other electronic applications, announced that the...
CEA-Leti has announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are...
Its official – having a cell phone has become more important to people than wearing shoes. You think I’m kidding?...
Things have been pretty crazy lately, what with wearing several hats and all. I spent two days in Silicon Valley...
This column by Francoise von Trapp appeared in the Jan/Feb 2011 issue of Chip Scale Review It sums up a...
Ziptronix Inc., the leading developer of direct bonding technology for advanced semiconductor applications, announced today that recent collaborations with major...
Ziptronix, Inc. has signed a licensing agreement with Sony Corporation for the use of Ziptronix’s patents regarding oxide bonding technology...
As dedicated as I am to the 3D integration cause, there’s not much that will get me out of...
When it comes to 3D chip stacking, chip-to-wafer (C2W) processes have proven to be the way to go for stacking...
CEA-Leti and its partners have developed a system combining motion-capture and precise indoor localization. The goal of this device is...
Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration,...
In a move that promises to provide increased performance and smaller size for portable electronics and other advanced systems, CEA-Leti...