San Jose, CA - September 29, 2011 - With the semiconductor industry’s transition to 3D-ICs gaining momentum, online resources focused...
I knew we were onto something when Leo Archer and I chose 3D ICs and 3D packaging as the top...
What the room heard: Get ready for a second downturn. DRAM is in the tank because PC production is down,...
Ultratech has earned ISO 9001:2008 and 14001:2004 certification from the DQS-UL Group for its international operations headquarters in Singapore and...
The Silicon Integration Initiative (Si2) announced today the founding members of their Open3D Technical Advisory Board (TAB), which is chartered...
Honeywell Microelectronics and Tezzaron Semiconductor are working together to produce a new range of radiation-hardened (rad hard) integrated circuits. Honeywell’s sturdy, well-qualified...
With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported...
SPP Process Technology Systems (SPTS), has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor...
GLOBALFOUNDRIES and Amkor Technology, Inc. have entered into a strategic partnership to develop integrated assembly and test solutions for advanced...
At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being...
NEXX Systems' 10th Anniversary celebration dawned sunny, warm and dry, a rare occurrence these days in the Northeast. In fact,...
ST. FLORIAN, Austria, November 8, 2011 — EV Group (EVG) , a leading supplier of wafer bonding and lithography equipment for...
Last time I visited Leti on the Minatec Campus was in October 2009. Recently, when I was back for Leti’s...
Through-silicon via (TSV) foundry,ALLVIA, has received official International Traffic in Arms Regulations (ITAR) registration from the U.S. Department of State,...
One year ago today, I was sitting with David Butler and Kevin Crofton, of SPTS, at the company headquarters in...
When we talk about 3D integration, we’re generally talking about 3D ICs driven by mobile market performance needs. But in...
“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate...
In this brave new world powered by consumer electronic devices that cater to the user experience, smartphones and tablets are...
Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top...
So there I was, listening to Eric Beyne talk about the importance of co-developing advanced CMOS and 3D ICs because...
