Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for...
MonolithIC 3D Inc., a Silicon Valley startup, announced today that it has been issued its fifth patent on monolithic 3D-IC...
Applied Materials, Inc. today announced a breakthrough technology for reducing power consumption in semiconductor chips with its new Applied Producer® OnyxTM...
Paul Enquist, Ziptronix Inc.’s chief technology officer and vice president of R&D, will provide an update on direct bond technology...
We’ve been hearing so much lately from the 3D integration cheering section, that it’s actually hard to believe that there...
SEMATECH’s 3D Enablement Center (3D EC), together with the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), has identified...
The partners in a new European research project today announced details of the multinational/multidisciplinary 'SMArt systems Co-design' (SMAC) program. This...
Two weeks ago, wearing my Chip Scale Review Sr. technical editor hat, I attended (along with 11 other journalists) an...
All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM...
With all the latest hubbub about FinFets (or as Intel calls them, TriGate transistors) , there seems to be some...
Once again I find myself using this blog space to venture outside the scope of normal coverage to offer some...
EVG's EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) Modules Enable Flexible Choice of Adhesives ST. FLORIAN, Austria, October...
Are you going to this year's MEMS Executive Congress? I was invited, but unfortunately won't be able to attend. I'm...
Enabling Commercialization of Groundbreaking Temporary Bonding and Debonding Technology ROLLA, MO, USA and st. florian, AUSTRIA, October 20, 2011 –...
To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for...
I had a bit of an “aha!” moment yesterday at the MEPTEC 2.5D, 3D and Beyond Conference, with regard to...
JDA to Extend Limits of Temporary Bonding/Debonding Technology to Support High-Topography Wafers and Chips SEMICON EUROPA, Dresden, Germany, October 11,...
Last week I attended SEMICO’s Research Summit, in Scottsdale, AZ, and was fortunate to hear some high-level industry executives discuss...
In this editorial commentary, blogger Ed Sperling, of the Low Power Engineering community, talks about the opportunities 3D stacking technologise...
Alchimer S.A. provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, has named Erik...
