Amkor Technology, Inc. provider of semiconductor packaging and test services, has granted SHINKO Electric Industries Co, Ltd. a non-exclusive license...
One of 60 research institutes that make up Germany’s Fraunhofer Gesellschaft, the Fraunhofer Institute for Reliability and Microintegration IZM is...
MonolithIC 3D Inc., a Silicon Valley startup specializing in 3D ICs, announces a milestone with its 2D and 3D ICs...
Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications St....
Two years ago, I visited EV Group’s world headquarters in Schärding, Austria, and wrote about what they call their Triple...
There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with...
SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor and related markets, launched the RCD8, a new...
Tokyo Electron Limited announced the completion of a definitive acquisition agreement with NEXX Systems Inc. Over the years, NEXX collaborated...
New Platform Member Further Strengthens Supply Chain for EV Group’s New ZoneBOND™ Capable EZR® (Edge Zone Release) and EZD® (Edge...
Applied Materials Inc. and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research...
For those of us who attended Doug Yu’s keynote address at the 3D Architectures for Semiconductor Integration and Packaging Conference...
Enhanced Hardware, Software and Process Control Capabilities Enable Two-fold Increase in Throughput to Meet Productivity and Yield Requirements of Today’s...
Long before he set out on the 3D Holy Grail, Herb Reiter had other pursuits that involved bringing new technologies...
Here’s something new from previous Device Packaging Conferences – rather than a panel largely populated by members of the EMC3D...
It’s going to be a busy 3D week here at IMAPS Device Packaging Conference, in Scottsdale AZ. So I’m going...
I usually never miss the Academy Awards, but this year I am in Germany visiting Fraunhofer IZM ASSID in Dresden...
SUSS MicroTec a supplier of equipment and process solutions for the semiconductor industry and related markets and GenISys GmbH, provider...
I attended the annual IMAPS local chapter lunch here in Arizona last week and got the low-down on the semiconductor...
ANSYS subsidiary Apache Design, Inc. today introduced RedHawk(TM)-3DX to meet the power, performance and price demands of low-power mobile, high-performance computing,...
Grenoble- based research institute, CEA-Leti, has announced it will focus on a new collaboration model for a wide range of...
